Kent, This is old news, but did anyone post here AFLX's interaction with the Flip Chip Technologies Joint Venture in Phoenix?
ADFLEX SOLUTIONS TO TEAM WITH FLIP CHIP TECHNOLOGIES
TO ADVANCE FLEX DESIGN AND ASSEMBLY CAPABILITIES
CHANDLER, Arizona (May 12, 1998) — ADFlex Solutions, Inc. (Nasdaq NM: AFLX) today announced that it has teamed with Flip Chip Technologies, L.L.C. (FCT) to develop fine pitch solutions to address evolving technical needs in the computer, communications, and consumer electronics industries.
According to the companies, the joint program is expected to demonstrate a 25% reduction in current bump pitch to allow significant cost reductions in future silicon and flex circuit products. The companies also anticipate that the use of flip chip will promote gains in electrical performance, profile-size reductions, and decreased manufacturing and product costs. The effort will focus on advancing flexible circuit substrate and assembly technology employing the combined synergies of ADFlex's one-stop shop capabilities, and FCT's proprietary flip-chip bumping and wafer processing services.
Said Rolando C. Esteverena, ADFlex President and Chief Executive Officer, "This alliance we believe is very positive for ADFlex, FCT and our customers. This is a relationship that enhances our one-stop-shop capability. We already offer OEMs significant advantages of a single-source service for design, development and volume manufacturing of both flexible circuits and component assembly technologies. The ability to extend this service to include device bumping in conjunction with FCT will bring further efficiencies in product development cycles, technical capabilities and production costs." ADFlex believes the effort will ultimately bolster its position as a leading single-source worldwide supplier service in flex circuitry design, production and assembly.
Said Harry Hollack, FCT President and CEO, "We are very excited about this collaborative effort to address the evolving needs of our customers by taking advantage of the respective capabilities of our two organizations."
"The approach we are taking in this effort is consistent with our mission statement to be the world's premier wafer bumping resource through customer satisfaction and leading edge technology. Our partnering with ADFlex is an example of our commitment to be at the leading edge of technologies through establishing relationships to better service the needs of our customers."
ADFlex has developed fine pitch flexible circuit technology specifically to support flip chip. The company plans to further enhance fine pitch in single and double sided flex circuit processes and flip chip assembly technologies with the aid of advanced bump technology provided by FCT to produce highly cost effective and reliable products.
In the joint effort, FCT will provide solder bumping for a variety of fine pitch peripheral and array footprints which specifically address next generation Flip Chip-On-Flex (FCOF) requirements. The program will focus on defining qualifying factors that enable high yield assembly. This system level approach will determine the most effective devices and substrate layouts with respect to solder bump sizes, I/O placements and assembly processes. The program is expected to provide an extremely rugged and reliable assembly.
ADFlex Solutions, Inc. is a leading supplier of flexible circuit-based interconnect solutions to the computer, computer peripheral, communication and other industries. Applications for flex-based interconnects include cellular telephones, hard disk drives and other storage systems, high-end consumer products, notebook computers, pagers and personal communications systems.
FCT is an innovative, high-volume wafer bumping resource providing services and expertise to the semiconductor industry based on proven technology. A joint venture of Delco Electronics and Kulicke & Soffa Industries, FCT is an ISO 9002 and QS 9000 certified company formed in 1996 to offer merchant bumping services used in applications requiring higher performance, reduced form factor and lower costs than available through traditional surface mount technologies. |
