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To: OGM who wrote (2774)11/22/1998 12:28:00 AM
From: Douglas V. Fant  Read Replies (1) of 3029
 
OGM, I partially created the confusion. Usual boards to which semiconductor chips are attached are rigid and usually are made of ceramic material. Flexible substrate is just what it says it is- it is a "board" to which you attach the chips, but the board can be bent.

That makes it useful for jamming it into a small area on an electronic device such as a pager, cell phone, etc. Now jammed in that tightly you want size reduction in your semiconductor chips and an easier method of attaching the chip to the substrate- hence flip chips which are smaller and glue right to the substrate- no leads involved.

In fact FCT (http://www.flipchip.com) claims that in over 10 billion initial solder joint connections of flip chips to their substrates, that there has been no joint failures.That's a pretty good starting record....

In the article I wrote about a year ago, from people with whom I had spoken in theseiconductor industry, I estimated that about 5% of all chip production would be flip chips rather than the standard chip. perhaps that estimate was too low and maybe the market is a few percentag epoints bigger. Each percentage point represents lots of chips that need to be manufactured and assembled.

Also if you like innovative chip makers check out DSP- they just came out with a new ASIC which gathers many cell phone-related functions onto a single chip....

Sincerely,

Doug F.
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