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Technology Stocks : Micron Only Forum
MU 237.16+4.6%Dec 5 9:30 AM EST
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To: JungleCat who wrote (41249)12/6/1998 2:29:00 AM
From: Carl R.  Read Replies (3) of 53903
 
For what it's worth, the maximum die per wafer can be computed by this formula: Message 749959

To get 1200 possible die on a 200mm wafer would require a die size of 23mm2. To get 1200 die on a 300mm wafer would require a die size of 55mm2. Since most sources I have seen say that current die sizes are around 55-60mm2 the only way that Samsung could have 1200 possible die per wafer would be if they were running 300mm wafers, but so far as I know, only Siemens is running 300mm wafers, and then only on a pilot line.

Also for what it's worth, my rough yield calculations show that to achieve a yield of 92% you'd probably need a die size of about 10mm. At a more realistic die size of 55mm yields would be about 60%.

And finally for what it's worth let's do some really rough cost calculations. At $1500 per wafer and $2/chip for testing and packaging the cost per chip at 92% yield on 1200 die would be $3.36. This is realistic for 16mb parts, but not for 64mb parts. Using more realistic numbers of a 55mm die and 60% yields you get a cost of just under $7 a chip.

I believe that MU's costs are currently in the $7 range. I believe that some of the numbers presented on this thread are either total bull or are numbers for 16mb parts.

Carl
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