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Politics : Formerly About Applied Materials
AMAT 226.05+1.3%Nov 14 9:30 AM EST

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To: Gottfried who wrote (26983)12/7/1998 2:26:00 PM
From: Proud_Infidel  Read Replies (1) of 70976
 
Story posted 12:45 p.m. EST/9:45 a.m. PST, 12/7/98
Korea okays use of loans
to help restructure industry
By Jack Robertson

WASHINGTON -- The South Korean government today agreed to let the debt-laden chaebols convert some of the huge domestic bank loans into equity as part of a sweeping industry restructuring package, which includes the proposed chip merger of Hyundai Electronics Industries Co. Ltd. and LG Semicon Co. Ltd.

Hyundai and LG have agreed that by Dec. 25, one of the companies would take over control of the new chip combine. The two companies have little choice since independent U.S. consultant Arthur D. Little Inc. will recommend on Dec. 22 whether Hyundai or LG should run the merged chip company. The consultant firm is under contract with the Korean government.

Today's industry agreement also confirmed that Samsung Group will swap its fledging auto manufacturing operation to Daewoo Group in exchange for that firm's consumer electronics and home appliance subsidiary.

The debt-to-equity swap approved by the government was the latest wrinkle in the prolonged struggle to get the chaebols' financial house in order. No details were available on the amount of debt that could be converted to equity or timetable for the transactions. The debt swap is contingent upon the chaebols selling off or closing down other money-losing operations and securing foreign investments. The five top chaebols agreed to cut their number of subsidiaries in half from 264 to 130 within a year.

Previously the government had said any debt-for-equity swap would bar the domestic bank creditors from assuming management control of the corporations from the shares of stock they would receive.

U.S. electronic competitors, including Micron Technologies Inc., have said they would scrutinize any debt-for-equity conversion closely to be sure the Korean chip chaebols weren't being bailed out from alleged reckless borrowing of the past. The Semiconductor Industry Association has been adamant that no IMF rescue funds to Korean domestic banks should be used to bail out that country's chip producers.

The chaebols today also agreed to reduce their debt-to-equity ratios from levels exceeding 500-700% and 1,000% in the case of Anam Semiconductor to no more than 200% by the end of 1999. Earlier the chaebols had sought to relax the 200% level, claiming they might be unable to reach that threshold by the turn of the century.

The chaebols again pledged to eliminate all cross-subsidies among their affiliate operations by the March 2000. Critics said the chaebols propped by losing units by diverting funds from profitable ventures.

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