LSI Logic Qualifies MICROLAM(TM) Laminate Material for Flip Chip Packages
PRNewswire - 09:16 a.m. Dec 08, 1998 Eastern
MILPITAS, Calif., Dec. 8 /PRNewswire/ -- LSI Logic
Corporation (NYSE: LSI) today announced that it has qualified a
new, expanded PTFE-based organic laminate material for flip
chip packages capable of meeting the demanding requirements of
complex designs such as system on a chip. The newly qualified
organic material, called MICROLAM(TM) laminates was
developed by electronics materials pioneer W.L. Gore &
Associates Inc., of Newark, DE.
"This new substrate technology will help LSI Logic meet the
challenge of ever increasing signal count and I/O density
requirements in high-performance applications particularly in the
computer and communications market," said Dilip Mathew, LSI
Logic's packaging marketing manager.
As part of its system-on-a-chip strategy, LSI Logic has moved
aggressively to develop advanced packaging technology
designed to meet the requirements of complex semiconductor
designs. In 1996, the company introduced high-density, flip chip
interconnect packaging technology for its most complex chips.
Last March, LSI Logic became the first in the industry to offer a
complete family of flip chip packages using organic laminate
substrates. Organic laminate substrates have better performance
through copper interconnect, a lower dielectric constant and are
lower in cost than the latest glass ceramic materials.
Today, LSI Logic has taken a leadership role in the industry in
driving the acceptance of advanced packaging technology. At
LSI Logic, packaging issues are considered at the very outset of
the design process and that translates into designs with better
reliability in manufacturing and faster time to market.
"LSI Logic's innovative packaging design approach, teamed
with Gore's high-density capability and modified design
tolerances, permits reduction in the total number of metal layers
in the package," explained Mathew. Reducing the number of
metal layers significantly lowers cost while maintaining the
highest level of electrical and thermal performance.
LSI Logic expects that the newly qualified MICROLAM(TM)
laminate material will be used in manufacturing by mid-1999.
The company currently offers flip chip in a ball grid array (BGA)
package using a 1mm ball pitch. Ball counts range from 964 to
1732.
Flip chip BGA packages provide the highest electrical
performance available today through the elimination of the wire
bond, separate core and I/O power and ground reference planes
and the lowest dielectric constant available today. In addition,
this innovative package family has excellent thermal
performance. The backside of the flipped die is attached directly
to a heatspreader which covers the entire package. If necessary, a
heatsink can be added.
About LSI Logic
LSI Logic Corporation, The System on a Chip Company(R), is a
leading supplier of custom high-performance semiconductors
with operations worldwide. The company enables customers to
build complete systems on a single chip with its CoreWare(R)
design program, thereby increasing performance, lowering
system costs and accelerating time to market. LSI Logic develops
application-optimized products in partnership with trend setting
customers and operates leading edge, high-volume
manufacturing facilities to promote submicron chips. The
company maintains a high level of quality, as demonstrated by its
ISO 9000 certifications. LSI Logic is headquartered at 1551
McCarthy Blvd., Milpitas, California 95035, 408-433-8000,
www.lsilogic.com.
About W. L. Gore & Associates, Inc.
W. L. Gore & Associates, Inc., is an innovative, high
technology manufacturing company based in Newark, Delaware.
Gore has pioneered the use of expanded polytetrafluoroethylene
(ePTFE) to manufacture electronics, GORE-TEX(R) fabrics, and
a wide range of industrial and medical products. With more than
6000 associates, over a billion dollars in annual sales, and nearly
50 sites worldwide, Gore is well known for its unique corporate
culture and was recently named as one of the top 10 companies
to work for in America. MICROLAM is a trademark of W. L.
Gore & Associates, Inc.
NOTE: The LSI Logic logo design, CoreWare and The System
on a Chip Company are registered trademarks of LSI Logic
Corporation. All other brand or product names may be
trademarks or registered trademarks of their respective
companies. SOURCE LSI Logic Corporation
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Copyright 1998, PR Newswire
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