scuttlebutt, I can't comment on INVX's daily pattern- but flip chips are a growing usage in both computers and communications applications. INVX is making a realistic bet moving into this market.... Note here for e.g., that LSI Logic is now officially moving heavily into flip chip usage....
A service of Semiconductor Business News, CMP Media Inc.
Story posted 2:30 p.m. EST/11:30 a.m., 12/11/98
LSI Logic qualifies laminate
material for flip-chip packages
MILPITAS, Calif. -- LSI Logic Corp. here has qualified a new, expanded PTFE-based organic laminate material for flip-chip packages capable of meeting the demanding requirements of complex designs such as systems-on-a- chip (SOC). The organic material, called Microlam, was developed by W.L. Gore & Associates Inc., of Newark, DE. LSI Logic expects to use the material in manufacturing by mid-1999.
"This new substrate technology will help LSI Logic meet the challenge of ever increasing signal count and I/O density requirements in high-performance applications particularly in the computer and communications market," said Dilip Mathew, LSI Logic's packaging marketing manager
LSI Logic has been developing advanced packaging technology for its next-generation SOC designs. In March, it introduced a complete family of flip-chip packages using organic laminate substrates, which have better performance through copper interconnect, a lower dielectric constant, and are lower in cost than the latest glass ceramic materials (see March 4 story). Now, LSI is considering packaging issues at the outset of the design process.
"LSI Logic's innovative packaging design approach, teamed with Gore's high-density capability and modified design tolerances, permits reduction in the total number of metal layers in the package," said Mathew. Reducing the number of metal layers significantly lowers cost while maintaining the highest level of electrical and thermal performance, he added. |
