Monday December 14, 8:09 am Eastern Time
Company Press Release
Vitesse Elects New Vice Presidents for Continued Growth and Profitability
CAMARILLO, Calif.--(BUSINESS WIRE)--Dec. 14, 1998--Following its most profitable year, Vitesse Semiconductor Corp.
(NASDAQ:VTSS - news) Monday announced that the Board of Directors has elected five new vice presidents.
The company named Yatin Mody to Vice President and Controller; Jim McDonald to Vice President, Dallas Design Center; Roy Carew to Vice President, Assembly
and Test; Pat Jenkins to Vice President, Colorado Springs Wafer Fabrication; and Mike Yeager to Vice President, Colorado Springs Design Center.
These newly appointed vice presidents will allow the company to continue to meet the growing customer demands as the company expands.
Yatin Mody, Vice President And Controller
Mody began his career at Vitesse in 1992 as manager of cost accounting and budgets, and was promoted to controller in 1993. Prior to that, Mody spent six years at
Deloitte & Touche, most recently as a manager, where he was responsible for the management and supervision of several customers' accounts.
Mody received his MBA in Finance from the University of California at Los Angeles and his B.Tech in Electrical Engineering from the Indian Institute of
Technology.
''Yatin has been a key contributor to Vitesse's rapid growth,'' stated Gene Hovanec, Vitesse vice president and chief financial officer. ''As we continue to grow, we
are relying on Yatin and his finance team to help build Vitesse into a solidly run and financially successful company,'' concluded Hovanec.
Jim McDonald, Vice President, Dallas Design Center
As Vice President, Dallas Design Center, McDonald will be responsible for the operation of Vitesse design centers located in Richardson, Texas and the newly opened
center in Melbourne, Fla. McDonald reports to Michael Millhollan, vice president and general manager, datacom division.
McDonald started his career at Vitesse in 1985 as a member of the technical staff. Since that time, McDonald has held several design management positions at Vitesse.
McDonald received his MSEE and BSEE from the University of Missouri at Columbia.
''Jim's design experience made him a natural choice to manage these two design centers,'' stated Millhollan. ''Vitesse's directive of working closely with our
customers in designing the next generation of communication products makes it important to have available technical staff in these two areas. And, under Jim's
tutelage, the design centers will excel at meeting this directive,'' concluded Millhollan.
Patrick Jenkins, Vice President, Colorado Springs Wafer
Fabrication
Jenkins joined Vitesse in 1997 with the responsibility for the process engineering organization at Vitesse's Pierre Lamond Wafer Fabrication facility in Colorado
Springs. He was a member of the start-up team that brought the fab into production to a very aggressive schedule supporting the company's revenue growth.
In his new position, Jenkins will report to Bob Cutter, Vice President, manufacturing. He has over 20 years experience in the industry in various technical and
management positions at Intel, Inmos, UTMC and Atmel. Jenkins received his BS, ChE from the California Institute of Technology.
''Patrick has a wealth of experience in wafer fab operations,'' stated Cutter. ''This background will ensure that the Colorado Springs fab continues on its successful
ramp to meet the growing demand for our products,'' continued Cutter.
Roy Carew, Vice President, Assembly and Test
Carew has been at Vitesse for over 11 years in various managerial positions in test engineering, most recently as director of assembly and test. Prior to that, he worked
in the GaAs Research Group at Rockwell International and was Test Engineering Manager at Pacesetter.
Carew received his BSEE from the University of Illinois. In his new position Carew will report to Cutter and will continue to manage assembly, test and subcontract
operations based in Camarillo.
''Roy has provided the direction and leadership of our assembly and test operations through a period of rapid growth in product output. His extensive knowledge of
our products will help us drive further improvements in responding to customer requirements supporting the future growth of the company,'' concluded Cutter.
Mike Yeager, Vice President, Colorado Springs Design Center
Recently elected Yeager, vice president, Colorado Springs design center, will report to Bob Nunn, general manager, telecom division. Yeager has over 17 years
experience in digital and memory design as well as high level technical management, most recently at Ramtron International Corp. [Nasdaq:RMTR - news] as vice
president of Ferro-Electric RAM design.
Yeager received his BS in Electrical and Computer Engineering from the University of Wisconsin. ''Yeager's technical leadership in the design of Vitesse's telecom
ICs will expedite the design of the next generation of communication equipment,'' stated Nunn.
Vitesse Semiconductor is a world leader in the design, development, manufacturing and marketing of high-bandwidth communications and Automatic Test
Equipment (ATE) integrated circuits (ICs). The company's products address the needs of telecommunications, datacommunications and ATE equipment
manufacturers who demand a combination of high speed, high complexity and low power dissipation.
Vitesse has headquarters in Camarillo, and manufactures volume ICs at its two fabrication facilities in Camarillo and Colorado Springs. Company/product information
can be found on the Web at www.vitesse.com.
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