LSI Logic Licenses Flip Chip Technology to Global Packaging Leader
Amkor Technology - PRNewswire, 09:16 a.m. Dec 15, 1998 Eastern
MILPITAS, Calif., Dec. 15 /PRNewswire/ -- System-on-a-chip
leader LSI Logic Corporation (NYSE: LSI) and worldwide
packaging leader Amkor Technology Inc. (Nasdaq: AMKR) today
announced a definitive agreement for Amkor to license LSI Logic's
organic laminate flip chip technology. Financial terms of the
licensing agreement have not been made public.
Through the agreement, Amkor will have access to LSI Logic's
organic laminate flip chip technology, a key component in
system-on-a-chip integration, for use by Amkor customers in
high-volume markets.
The endorsement from Amkor, the world's largest contract chip
assembler, is a major step toward establishing LSI Logic's flip chip
technology as an industry standard. LSI Logic has consistently
provided advanced packaging technology capable of meeting the
requirements of system-on-a-chip designs. At LSI Logic,
packaging issues are considered at the very outset of the design
process and that translates into designs with better reliability in
manufacturing and faster time to market.
"We are pleased to have the opportunity to license a key component
of LSI Logic's advanced packaging process technology that makes
single-chip systems a reality," said John Boruch, president of
Amkor. "Licensing LSI's technology ensures that we will continue
to advance efforts toward supporting our customers' flip chip
requirements. We are now well positioned to support our
customers' growing demand for system on a chip and other highly
integrated device designs," Boruch said.
"This agreement with Amkor makes our most advanced flip chip
packaging technology available to LSI Logic customers at their
offshore production sites and also complements our internal flip
chip development," said Maniam Alagaratnam, LSI Logic vice
president of package development. "Amkor chose LSI Logic
because our solution is fully qualified and offers the best
combination of performance, versatility and cost effectiveness,"
Alagaratnam noted.
The licensing agreement calls for the flip chip technology to be
transferred later this year. The technology will used in
manufacturing at both Amkor's Chandler, Arizona facility and the
company's overseas factories.
Flip chip packages provide the highest electrical performance
available today. This is achieved by elimination of the wire bond
and separate core and I/O power and ground. LSI Logic was one of
the first in the industry to qualify a flip chip package using organic
laminate substrates, which provide excellent performance through
copper interconnect, have a lower dielectric constant and cost less
than the latest glass ceramic materials. Laminate materials
significantly reduce noise, allow finer lines and improve overall
system performance.
The organic laminate flip chip packaging allows LSI to pack more
signals into the same or smaller space on a chip to meet increasing
performance demands from customers, particularly for networking
and computer equipment designs.
About LSI Logic
LSI Logic Corporation, The System on a Chip Company(R), is a
leading supplier of custom high-performance semiconductors with
operations worldwide. The company enables customers to build
complete systems on a single chip with its CoreWare(R) design
program, thereby increasing performance, lowering system costs
and accelerating time to market. LSI Logic develops
application-optimized products in partnership with trend setting
customers and operates leading edge, high-volume manufacturing
facilities to promote submicron chips. The company maintains a
high level of quality, as demonstrated by its ISO 9000
certifications. LSI Logic is headquartered at 1551 McCarthy Blvd.,
Milpitas, California 95035, 408-433-8000, www.lsilogic.com.
About Amkor
Amkor Technology, Inc., founded in 1968, is the world's largest
independent provider of semiconductor packaging and test services.
The company offers a complete set of services including deep
submicron wafer fabrication, wafer probe testing, IC packaging
assembly and design, final testing, burn-in, characterization and
reliability testing. More information on Amkor Technology, Inc. is
available from the company's SEC filings and on Amkor's web
site, amkor.com. Amkor Technology, Inc. is traded on
Nasdaq under the symbol AMKR. SOURCE LSI Logic
Corporation
Copyright 1998, PR Newswire
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