Chip-Scale Packaging (CSP) Will Be in Short Supply in 1999
According to EE TIMES:
NEW YORK — Chip-scale packages (CSPs) could be in short supply next year if its Direct Rambus DRAMs (D-RDRAMs) are quickly adopted, warned Rambus Inc. chief executive officer Geoff Tate. Rambus said it hopes that its 10 RDRAM licensees will ship between 100 million and 200 million D-RDRAMs next year. For density and electrical reasons, Rambus designed its D-RDRAM with chip-scale packaging, but few of Rambus' 14 DRAM partners have installed volume CSP production capability, Tate said.
Concern about a possible shortage in CSPs was shared by Paul Hoffman, vice president of advanced development at Amkor Electronics Inc. (Chandler, Ariz.). "We're producing 300,000 to 400,000 CSPs per week, probably second in the Tessera-style parts," he said. "We're meeting demand, but we're doing SRAMs and flash memory, not DRAM. When demand for Rambus chips kicks in, there could be a situation where there are shortages for a while."
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eetimes.com |
