PAi-
The 15% comment related to the percent of the market which has a trench capacitor design. Combining Toshiba, IBM, and Siemens market shares arrives at this figure. Sorry I was not more clear. Trench capacitors design the capacitor dielectric into the silicon in a trench rather than above the gate in poly lines. Micron has had the edge in shrink in the past because they use a high surface area poly similar to HSG. The standard is now becoming this HSG, so others will soon catch MU. It will take time, though.
Hyundai is close to Samsung, but LG is behind in both yield and die size. NEC actually is on par with Samsung for most issues, although recently has started to edge ahead. I have an entire database, but only chose a few select ones. The reason I chose Fujitsu was, indeed, just because they appear to be the least committed of the major Japanese. My point was that if they can do it, then the others could and have as well.
I assure you, my analysis is anything but superficial. |
