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Technology Stocks : ADFLEX SOLUTIONS ( AFLX )

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To: Douglas V. Fant who wrote (511)	1/20/1999 12:57:00 AM
From: Douglas V. Fant	Read Replies (2) of 718

Gang, From FCT's Website, AFLX's partner in flip chip research, just in case you have forgotten what flip chips are..... ------------------------------------------------------------------------ Demand by semiconductor manufacturers and OEMs for designs that require size and weight reduction, improved electrical performance and cost savings will facilitate tremendous growth in flip chip and chip scale package (CSP) technologies during the next five years. As the number of I/Os per device increases, pad-limited silicon becomes a greater issue. Manufacturers are moving to full area array or partial area array I/O designs requiring flip chip interconnect technology in place of wire bonding. Why flip chip technology? Flip chip technology is a form of semiconductor packaging that uses solder bumps as an interconnection between the integrated circuit (IC) and the substrate. Compared to other popular packaging technologies such as wire bonding, flip chip technology provides: shorter possible leads lower inductance higher frequency better noise control higher density higher I/O smaller device footprints and a lower profile Why wafer-level chip scale packaging? By definition a chip scale package is no more than 20% larger than the size of the die. Wafer-level packages are picked and placed directly from the wafer making for a more cost-effective assembly process. Wafer-level chip scale packages such as our Ultra CSPTM, provides smaller device footprints, a lower profile, and reduced assembly costs. Why Flip Chip Technologies? FCT provides high volume wafer bumping services and expertise to the semiconductor industry. Our solder bump interconnect structure facilitates advanced electronic packaging solutions such as flip chip on board--laminate, flex, or ceramic; flip chip in package (BGAs and CSPs); and wafer level chip size packages including FCT's new Ultra CSP.TM

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