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Technology Stocks : Alliance Semiconductor

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Jul 10 5:00 PM EST

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To: Woody_Nickels who wrote (4553)	1/23/1999 4:36:00 PM
From: DJBEINO	Read Replies (1) of 9582

UMC Group readies 0.18-micron process, IP library David Lammers Sunnyvale, Calif. - UMC Group said it is ramping 0.18-micron (drawn) process capacity now for foundry-service customers, and will be at 12,000 wafers per month by the middle of this year. UMC also is in the process of validating 0.18-micron cores at the physical level from many of the leading commercial intellectual-property (IP) vendors, and is expanding a "free IP" program for core customers. Total 0.18-micron wafer capacity will increase to 18,000 wafers per month by the end of the year, and 0.18-micron will be the most cost-effective technology by this time next year for its foundry-service customers, said Ray Cisneros, a product manager at UMC USA here. By the second half of 1999, UMC plans to offer copper interconnects on five of the six metal layers, complementing the "low-k" fluorinated silicon dioxide being used as the interlevel dielectric. techweb.com

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