A special thanks from all the SemiCap Longs ...
All Hail Intel ... Generator of Cash ... Dispenser of Funds ... Maker of Kings ...
THE PEOPLE OF SEMICAP LAND ARE IN AWE OF YOU FINANCIAL MIGHT ... WE PRAISE YOUR FOR YOUR VISIONARY THINKING ... WE ARE TRULY NOT WORTHY ... but, we'll take anything you are willing to give!!!
--Duker et. al.
Intel plans 300-mm fab in Oregon
By Jack Robertson
SANTA CLARA, Calif. -- Intel Corp. here has decided to go ahead with its first 300-mm, 0.13-micron-design-rule fab in Oregon, and next month will announce a 10-year, $10 billion program in the next-generation wafer size, sources said today.
Intel will launch construction this year of a 300-mm development fab that will expanded into initial production, according to the sources. Next month's announcement will cover a full-blown Intel plan to expand into multi-fab 300-mm production over the next decade.
Intel's commitment is expected to revive the chip industry's lagging 300-mm wafer interest. After Siemens Semiconductor Group and Motorola Semiconductor Products Sector launched a 300-mm pilot line in Dresden, Germany, other chip makers, including Intel, put their larger-size wafer plans on the shelf.
One major equipment firm, Applied Materials Inc., reportedly will reinstitute its own 300-mm program, based on a large order for equipment for the new Oregon fab. Along with the rest of industry, Applied froze its 300-mm program early last year when chip makers backed away from launching even pilot lines.
--Duker
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