NEWS For Immediate Release Company Contacts:
Analysts:
Jim Chiafery 215-784-6436
Media:
Henri Van Parys 215-784-6818
K&S Receives Order
For 120 Wire Bonders
Willow Grove, PA, February 3, 1999-Kulicke & Soffa Industries (NASDAQ: KLIC) has received a major order for its latest ball bonder. The order for 120 machines was placed by a major U.S. based manufacturer of semiconductor integrated circuits. Shipments will start in the third quarter of fiscal year 1999.
"We are beginning to see signs that K&S is emerging from the downturn that has affected the entire semiconductor industry since last year," said K&S Vice President & General Manager Dave Leonhardt. "We believe our order rate will improve over the next few quarters as more customers begin adding new capacity. We also believe our ball bonder market share will grow due to the productivity and capability of our latest ball bonder, which represents the industry's most advanced wire bonding platform."
Certain matters discussed in this news release, including forecasts of future demand, are forward-looking statements that are subject to risks and uncertainties that could cause actual results to materially differ, either better or worse, from those projected. Such risks and uncertainties include, but are not limited to, the following: the risk of order postponements or cancellations; the risks associated with a substantial foreign customer base; the risks associated with instability in foreign capital markets and foreign currency fluctuations; the upward and downward volatility in the demand for semiconductors and for the Company's products and services; competitive pricing pressures; the risk of delays in introduction and customer qualification of new products and services; and the Company's ability to manufacture and ship its products on a timely basis. Further discussions of risk factors are also available in the Company's most recent SEC filings.
Kulicke & Soffa is the world's largest supplier of semiconductor assembly equipment. The Company serves the integrated circuit assembly market with a product line that includes wire bonding, die bonding and wafer dicing equipment, as well as packaging materials, including bonding wire, capillaries, wedges, die collets and saw blades, and has sales and service facilities worldwide. The Company's web site address is www.kns.com.
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