Conflicting reports, This claims that 300mm is on the back burner. What do you think?
Copper Tools for IC Production to Reach $1 Billion Mark in 2000 According to the Information Network
February 4, 1999 04:37 PM
New Tripoli, PA--(BUSINESS WIRE)--Feb. 4, 1999--The market for front-end equipment for copper processing of IC interconnects will triple to slightly more than $1 billion in 2000, according to the report 300mm/Copper/Low-K Convergence: Timing, Trends, Issues, Market Analysis, recently published by The Information Network, a New Tripoli, PA-based market research company.
"With 300mm on the back burner, our analysis shows that copper technology is the next market mover," notes Dr. Robert N. Castellano, President of The Information Network. "Most of the major semiconductor manufacturers have announced production plans for copper and with the exception of IBM and Motorola are all scheduled to begin production in mid-1999 to mid-2000 timeframe."
Most companies had planned to transition to copper at the 0.15 or 0.13 micron design. Because of IBM IBM and Motorola MOT , that transition was pushed up to 0.18 micron, primarily for fear that the demand for high-speed ASIC requirements will push ASIC suppliers to foundries that could offer the technology.
Copper capabilities offers companies an opportunity to gain a technological edge with its products. While it is now and in the near future will be a niche market, it will become mainstream within five years, moving into high gear with 0.15- and 0.13-micron manufacturing.
The reports analyzes the market for all copper front-end tools, including Electroplating, Barrier/Seed, Dielectric Etch, CMP, Dielectric Deposition, Metrology, RTP, and Metal Etch.
Companies poised to take advantage of the opportunities in the nascent copper market include Novellus NVLS , Semitool SMTL , Lam Research LRCX , AG Associates AGAI , and KLA KLAC .
The Information Network is the leading consulting and market research company addressing the semiconductor, computer, and telecommunications industries.
Web - www.theinformationnet.com
E-mail - tin@theinformationnet.com
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