QUALCOMM Announces Sixth Generation CDMA Single-Chip Modem Solution
- New CDMA Chipset Solution Provides a 50 Percent Reduction in Size
While Increasing Standby Time to 300 Hours -
NEW ORLEANS, CTIA '99, Booth #3125, Feb. 8 /PRNewswire/ -- QUALCOMM
Incorporated (Nasdaq: QCOM), pioneer and world leader of Code Division
Multiple Access (CDMA) digital wireless technology, today announced the
introduction of the MSM3100(TM), the company's sixth generation single-chip
Mobile Station Modem(TM) (MSM(TM)) baseband processing solution. This new
generation chipset and system software solution features a 50 percent
reduction in chip size and up to 300 hours of standby time.
"Our business is to work closely with the industry to define, develop and
deliver on future needs for wireless communication," said Don Schrock,
president of QUALCOMM's CDMA Technologies. "With the introduction of the
sixth-generation MSM3100 chipset and software, we are taking our proven CDMA
solutions to the next level of integration and cost savings while adding
support for new high performance voice and data processing features. Combined
with new tools and our world-class technical support staff, this ensures
continued industry leading phone development times for our customers."
The MSM3100 chipset and software enable design of a new generation of CDMA
handsets and data devices with rich feature sets and industry-leading
performance. Higher on-chip integration now includes the addition of analog
cores such as a 13-bit linear audio-codec, PLL, DAC's and ADC's. This
facilitates a 50 percent size reduction of the printed circuit board area as
well as a significantly reduced part count and lower bill-of-materials cost.
With new system software and hardware for enhanced system power control,
stand-by times will also be approximately 50 percent higher than previous
generation solutions. The MSM3100 chip incorporates advanced digital signal
processing (DSP) functions, a Universal Serial Bus (USB) high speed data
interface and support for additional CDMA Designer(TM) development tools.
These enhancements allow phone manufacturers to further innovate and
differentiate their CDMA handsets while reducing time-to-revenue.
New features include: Enhanced voice recognition, such as continuous
digit dialing and support for large speaker independent libraries; and on-chip
acoustic echo cancellation, eliminating the need for additional costly
hardware in automotive, PC and other speaker phone applications. A Universal
Serial Bus (USB) interface enables effective interconnection to desktop,
laptop and Palm PC devices for much higher speed multimedia data transfers and
software synchronization. The MSM3100 chip will also be the first baseband
modem in the world to offer on-chip hardware support for in-phone Global
Positioning System (GPS)-based CDMA position and location services which
provides manufacturers with a cost-effective and integrated solution for the
upcoming FCC mandate for emergency location tracking (E911).
"This is our most powerful chip to date," said Johan Lodenius, vice
president of marketing for QUALCOMM's CDMA Technologies. "The MSM3100
solution provides a comprehensive set of advanced features with supporting
tools as well as a robust and proven software package. This will enable CDMA
handset manufactures to create a wide array of products with unprecedented
functionality, form factors and operating performance."
Features of the MSM3100 Chip Include:
-- QUALCOMM's newly developed integrated QDSP2000 digital signal
processing (DSP) core, easily enables the additional performance requirement
for advanced features such as voice recognition, GPS-based position location,
speech compression, acoustic echo cancellation, noise suppression, and other
audio enhancements. Acoustic echo cancellation support in the QDSP2000 core
eliminates the need for DSP's in car-kits for additional cost savings.
-- The QDSP2000 core features 40-bit computation units and datapaths, up
to five operational executions in parallel, variable-length instructions to
conserve program memory, and single-cycle instruction execution for
computations. The powerful QDSP2000 consumes less power with better
performance and only requires 8 Mips for Enhanced Variable Rate Coder (EVRC)
execution, versus competitive digital signal processors requiring more than 20
Mips. A complete GUI-based software development toolkit for Sun and PC
platforms is available for customized features.
-- The integrated industry-standard ARM7 TDMI(R) microprocessor offering
much higher performance with lower power consumption and smaller relative
compiled-code size. The ARM7 is ideal for support of manufacturer application
demands today as well as for the future. To facilitate software development
the ARM peripherals have been customized by QUALCOMM to facilitate in-phone
debugging capabilities of production handsets. ARM software tools are
available directly from QUALCOMM to assist manufacturers with software
development.
-- Support for CDMA position location services utilizing GPS-based
technology. This provides manufacturers with a cost effective and
highly-integrated solution for the upcoming FCC E911 mandate.
-- IS-95B compliant demodulator architecture, to support simultaneous
demodulation of up to six or eight channels, depending on the rate-set used,
for a maximum speed of 86.4 kilobits per second (kbps).
-- Various analog cores are integrated onto the MSM3100 chip, reducing the
number of handset components for substantial cost savings and reduction of PCB
area. Included on the chip are: A 13-bit linear audio voice codec with
Automatic Gain Control (AGC) function and integrated earphone amplifiers; PLL
for support of various TCXO frequencies; on-chip voltage regulators for a
single 2.5 volt (v) input interface that support internal chip voltages as low
as 1.8 v; dual 8-bit transmit IQ DAC's which simplify the interface to the
transmit Radio Frequency (RF) chain; and ADC's for battery and temperature
monitoring. This level of integration enables shrinking of the printed
circuit board by 50 percent for a very cost effective and low power design.
-- A new enhanced sleep controller for both CDMA and AMPS modes will cut
power consumption significantly in the MSM chip and for the entire phone. For
example, an estimated 300 hours of stand-by time can be achieved in CDMA mode.
-- Multiple serial interfaces including: Universal Asynchronous Receive
Transmits (UARTs) for data communications as well as diagnostic monitoring;
QUALCOMM developed Serial Bus Interface (SBI) for low speed control of RF and
peripheral devices for power management; and USB for easy interconnection to a
PC or car kit. With the greatly increasing popularity of USB in the PC
marketplace, this interface is ideal for plug and play mobile phone
connections to PC's and consumer appliances.
-- An optimized system software solution which is fully compliant with
dual-mode cellular and Personal Communications Service (PCS) band IS-95B
specifications. The software includes a full suite of Internet protocols for
fast development of data applications and ships fully tested and integrated
into QUALCOMM's CDMA development tools for fast and flexible customer
development.
QUALCOMM's MSM3100 chip interfaces directly with the IFR3000(TM) chip, the
RFR3100(TM) and RFT3100(TM) chips, QUALCOMM's next generation fully integrated
Intermediate Frequency (IF) chipset and the new PM1000(TM) power management
chip.
System development software, verification, test, debug, calibration,
manufacturing and field test support are available using the CDMA Designer
development tools reducing time to market for a complete CDMA handset. Target
applications include very small voice, high data rate and advanced user
interface subscriber units for multi-mode cellular and PCS CDMA services.
The MSM3100 chip will be fabricated in a 0.18 um Leff process at 2.5V
plus/minus 10% in 0.8mm ball pitch 208-pin Fine Pitched Ball Grid Array (FBGA)
package. For maximum current savings, the internal cores of the chip will
operate down to 1.8 v. The 208-pin FBGA package is in a four-perimeter-rows-
of-solder-balls (P4) configuration making circuit routing and assembly easier
and enabling the use of cost effective printed circuit boards. Sample
shipment to customers will begin in the third quarter of 1999 with production
volumes starting by the end of the year.
QUALCOMM CDMA Technologies is the leading developer and supplier of CDMA
chipsets, hardware and software solutions and tools with more than 30 million
MSM chips shipped worldwide. The division supplies chipsets to the world's
leading CDMA handset and infrastructure manufacturers including: ALPS ELECTRIC
CO., LTD.; CASIO COMPUTER CO., LTD.; DENSO CORPORATION; FUJITSU LIMITED;
Hitachi, Ltd.; Hyundai Electronics Industries Co., Ltd.; KYOCERA CORPORATION;
LG Information and Communications, Ltd.; Samsung Electronics Ltd.; SANYO
Electric Co., Ltd.; and Toshiba Corporation, among others.
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