TI Announces High Volume Burn-in Test Solution For Direct Rambus Memory Interface Technology
ATTLEBORO, Mass.--(BUSINESS WIRE)--Feb. 10, 1999--Texas Instruments' Interconnection Business today announced the availability of a family of burn-in test sockets for Direct Rambus(TM) memory devices. The new sockets will enable DRAM manufacturers to test devices that incorporate the popular memory management architecture developed by Rambus, Inc., ensuring they are fully tested and burned-in.
Rambus memory architecture is one of the most widely licensed technologies in the semiconductor industry. Currently, over 50 companies are committed to deliver Direct Rambus technology within their products, including 15 DRAM manufacturers, 20 logic IC suppliers and 25 manufacturers of system-memory implementation products.
The family of test sockets developed by TI's Interconnection Business give DR DRAM manufacturers a way to identify functional defects in singulated packages before assembly. The sockets feature an open-top design for ease-of-use, and are designed to accommodate the most popular IC package formats, including center-load bonded, next-generation packages, sized 0.8 x 1.0mm - 9x8, as well as edge-bonded, initial de-populated (72 I/O) packages, sized 0.75 x 0.75 - 16x7.
TI, the worldwide leader in burn-in test sockets, is one of the first companies to develop a Direct Rambus burn-in test solution, according to Edmund F. Craig, III, sales & marketing manager for Texas Instruments' Interconnection Business.
''Just as the Direct Rambus DRAM market takes off, TI is ready with a family of high-volume burn-in test sockets that is flexible enough to accommodate the various design requirements of today's IC manufacturers. As the volume of memory chips--lead by DRAMs--skyrockets in 1999, TI is already delivering to the market a robust solution.''
The just-announced sockets from TI are being evaluated by DRAM manufacturers in Asia, Europe and the U.S.A., and are expected to be in volume production by mid-1999. Since TI's sockets utilize existing test equipment and standard processing, such as burn-in boards and ovens, market adoption should be strong.
In addition, the market has signaled it is ready for Rambus. Rambus-based PCs are expected to have two to three times as much bandwidth as most PCs on the market today. Announcing its own plans, Intel Corp. said it will use Direct RDRAM as the main memory technology for mainstream performance desktop PCs in 1999.
Texas Instruments Incorporated is a global semiconductor company and the world's leading designer and supplier of digital signal processing and analog technologies, the engines driving the digitization of electronics. Headquartered in Dallas, Texas, the company's businesses also include materials and controls, educational and productivity solutions, and digital imaging. The company has manufacturing or sales operations in more than 25 countries.
Located in Mansfield, Mass., the Interconnection Business is part of TI's Materials & Controls group.
Texas Instruments is traded on the New York Stock Exchange under the symbol TXN. More information is located on the World Wide Web at ti.com |
