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Motorola Places Volume Purchase Order With ASML
Order for Multiple Deep UV and i-Line Step & Scan Systems,
to be Used in Motorola's Advanced Copper Process,
Marks First Business Between the Two Companies
VELDHOVEN, The Netherlands--(BUSINESS WIRE)--Feb. 12, 1999-- Motorola Inc.'s Semiconductor Products Sector has entered
a volume purchase agreement with ASM Lithography (ASML) (Amsterdam Exchanges: ASML) (Nasdaq/NMS: ASMLF - news) for
multiple advanced photolithography systems to be installed at the global IC manufacturer's wafer fabs in Texas and Arizona. This
phase of the agreement is valued at more than NLG 100 million (USD 50 million), and marks the first business between the two
companies.
The order includes ASML's most advanced deep UV and i-line Step & Scan tools: PAS 5500/400B i-line, PAS 5500/550B deep UV
and PAS 5500/700B deep UV systems. The latter system was just introduced in October 1998. Some of the equipment in this order
has already been shipped and installed.
''ASML's Step & Scan systems have demonstrated the high productivity and superior overlay performance needed to enhance the
cost competitiveness of our IC manufacturing program,'' said William Dunnigan, vice president, director Die Manufacturing,
Motorola's Semiconductor Products Sector. ''Our decision to partner with ASML is a key step in laying the groundwork for
Motorola's future growth.''
ASML's i-line PAS 5500/400B Step & Scan system is specified for 280 nm resolution. Of the deep UV Step & Scan tools in this
order, the PAS 5500/550B tool is designed for 180 nm resolution, while the PAS 5500/700B is capable of 150 nm resolution. All three
systems are high-productivity tools, each capable of processing more than 104 200 mm wafers per hour, and designed to achieve
cost-effective, mix-and-match lithography solutions. |
