News summary:
NEW PRODUCTS
TI rolls out burn-in sockets for Direct Rambus DRAMs (2/16/99)
TI says its new socket design will enable memory makers to burn-in and test the Direct RDRAMs before devices are fully assembled, which will help the eliminate wasted costs in chip-packaging plants. (Semiconductor Business News)
Toshiba continues string of Rambus leadership firsts - Toshiba Rev. B RDRAM samples enable Intel testing of fully loaded system (1/27/99)
Toshiba America Electronic Components, Inc. (TAEC) today announced another Rambus® technology leadership achievement with the delivery of its 64 megabyte (MB) and 128MB Revision B Rambus RIMM™ memory module samples to Intel. (EDTN WebScan)
Samsung Electronics develops world's first 144M Rambus DRAM (11/5/98)
The South Korean electronics giant has become the world's first to complete development of a 144Mbit Direct Rambus DRAM component and 144MByte Rambus In-line Memory Module. (EDTN WebScan)
NEWS
Hyundai readies Rambus push (2/18/99)
Hyundai Electronics will begin to ship commercial quantities of the Direct Rambus DRAMs in May, starting at 64-Mbit and 72-Mbit densities, and move into full volume production by July. (EE Times)
Fujitsu sees more delays in Direct Rambus (2/17/99)
Masao Taguchi, deputy general manager of Fujitsu's DRAM Division (Kawasaki, Japan), said in an interview that tight supplies of Micro-BGA packages and of high-end testers for the fast memories is limiting the company's Direct Rambus production. (EE Times)
ASML scores $50 million order from Motorola (2/16/99)
ASML said the new lithgoraphy systems will be used to produce Direct Rambus DRAM chips. (Semiconductor Business News)
Rambus adds National to licensee list (2/12/99)
National Semiconductor Corp. has become the third major PC microprocessor vendor to license a high-speed DRAM interface from Rambus Inc., following Intel Corp. and Advanced Micro Devices Inc. (Electronic Buyers' News)
Delay seen for Intel's Camino chip set (2/12/99)
Difficulties in taking the Intel Camino chip set and the Rambus DRAMs it supports to the speeds necessary to accommodate a 133-MHz system bus may delay the rollout of personal computers based on the full-speed Rambus technology, sources said. (EE Times)
Rambus signs on another switch-chip maker (2/11/99)
Looking to expand its efforts in the LAN space, Rambus Inc. has licensed its high-speed memory interface technology to SwitchCore Corp., a Swedish company that is developing a high-end, Layer 3-based switching chip for Fast Ethernet and 1-Gbit/s networks. (Electronic Buyers' News)
Reputed chipset delay could water down Rambus launch (2/10/99)
Intel Corp. chipsets supporting the new 800 MHz DRAM interface developed by Rambus Inc. will be delayed until at least the third quarter, according to a prominent Wall Street analyst. (Electronic Buyers' News)
National Semiconductor® licenses Rambus® interface technology - high bandwidth supports future high-performance processors (2/10/99)
National Semiconductor Corporation® (NYSE:NSM) announced today it has licensed the Rambus® high-bandwidth 800 MHz memory interface for use in future integrated processors developed by its Cyrix subsidiary. (EDTN WebScan)
Intel said to offer cash to Toshiba for Direct RDRAM production (2/4/99)
Toshiba Corp. today confirmed reports in Japan that the firm has received a proposal from Intel Corp. for a cash infusion to cover the investment for ramping up production of Direct Rambus DRAM memory chips. (Semiconductor Business News)
HP Licenses Rambus Interface (2/2/99)
Hewlett-Packard Company and Rambus Inc. today announced that HP has licensed Rambus interface technology and intends to offer Rambus memory subsystems to a variety of HP system divisions. (EDTN WebScan)
Vendors scramble to keep pace with Rambus (1/29/99)
The Rambus machine is hitting full throttle, as chip, module and tester vendors take steps that may help ease a predicted shortage of Direct Rambus devices this year. (EE Times)
Toshiba ships Rambus RIMMs to Intel for 800-MHz testing (1/28/99)
Toshiba America Electronic Components Inc. here today announced it has delivered samples of 64-megabyte and 128-Mbyte Rambus RIMM memory modules to Intel Corp. for testing in high-speed systems. (Semiconductor Business News)
Kingston ramps RIMM module production to meet Direct RDRAM demand (1/27/99)
Memory module maker Kingston Technology Co. is ramping RIMM module production, citing increasing demand for boards that support the new Direct Rambus DRAM specification. (Electronic Buyers' News)
TSMC to add Rambus to its 0.25-micron technology (1/26/99)
Taiwan Semiconductor Manufacturing Co. today announced that will port the Rambus ASIC Cell (RAC) to its 0.25-micron logic process. (Semiconductor Business News)
Intel invests $100 million in Samsung to aid Rambus output (1/22/99)
Intel Corp. will invest $100 million in Samsung Electronics Co. to help accelerate the South Korean chip maker's production of Direct Rambus DRAMs. (EE Times)
PC makers may see sparse Rambus DRAMs supplies this year (1/20/99)
As the PC industry begins its countdown to Direct Rambus DRAM technology, companies are already grappling with the specter of a supply crunch for the devices. (EE Times)
Intel announces intent to invest $100 million in Samsung Electronics to accelerating RDRAM supply (1/20/99)
Samsung Electronics will use the proceeds from this investment and additional funds to invest in Direct RDRAM fabrication, assembly and test. Samsung is already shipping sample Direct RDRAM devices and is ready for volume production in second quarter of 1999. (EDTN WebScan)
UMC offers 0.25-micron foundry service for Rambus customers (1/20/99)
UMC Group said it will offer its foundry services to controller-chip developers that utilize the Direct Rambus ASIC Cell (RAC) memory interface of Rambus Inc. (Electronic Buyers' News)
UMC offers 0.25-micron foundry services for Rambus customers (1/19/99)
UMC Group announced today that it will offer its foundry services to controller-chip developers that utilize Rambus Inc.'s memory interface, the Direct Rambus ASIC Cell (RAC). (Semiconductor Business News)
Samsung accelerates production of initial Rambus DRAMs (1/19/99)
Samsung predicts that Rambus DRAMs will be used in 30% of new PCs in 1999, representing a $2.6 billion chip market. (Semiconductor Business News)
Rambus reports first quarter financial results (1/14/99)
First quarter revenues were up $10.6 million, a 13% increase from the same period last year. (EDTN WebScan)
Acer to support Rambus for consumer PCs (1/13/99)
Acer Laboratories Inc. here announced today that it has licensed 800-megahertz memory-interface technology from Rambus Inc. (Semiconductor Business News)
Intel demonstrates system with Direct Rambus DRAM (11/20/98)
At Comdex a prototype system running with Direct Rambus DRAM main memory and a 133-MHz front-side bus shows Intel is ready to make Rambus available in the 1999 PC market. (Electronic Buyers' News)
Siemens makes Direct RDRAM with 0.20-micron technology (11/9/98)
Siemens AG's semiconductor unit here today claimed to be the first to produce functional 64-Mbit and 72-Mbit Direct Rambus DRAMs. (Semiconductor Business News) |
