Monday February 22, 8:26 am Eastern Time
Company Press Release
Electroglas' Quicksilver Receives '1999 Best in Test' Award From Test & Measurement World
QuickSilver Only Post-fab Inspection Tool to Receive Prestigious Honor
SANTA CLARA, Calif.--(BUSINESS WIRE)--Feb. 22, 1999-- Electroglas Inc. (Nasdaq:EGLS - news), a leading supplier of essential process management tools for the semiconductor industry, today announced that its QuickSilver(TM) post-fab inspection system received a ''1999 Best in Test'' award from Test & Measurement World magazine.
The annual award recognizes the ten best electronics test and measurement products released between Nov. 1, 1997, and Oct. 31, 1998. Recipients of the award are selected by the editors of Test & Measurement World magazine.
''We are gratified that the editors of Test & Measurement World identified QuickSilver as one of the premier test products of the year,'' said Curt Wozniak, chairman and CEO of Electroglas. ''QuickSilver is the only post-fab inspection tool to receive the Best in Test award, and this recognition is a testament to Electroglas' groundbreaking work in the inspection arena. The QuickSilver system provides companies with an essential process management tool with the high throughput and accuracy necessary for cost-effective automation of wafer inspection operations.''
Electroglas' Quicksilver is used in a variety of applications including the automatic inspection of bumped wafers, typically found in chip-scale and flip-chip packages for telecommunication ICs and microprocessors. The QuickSilver system integrates a high-speed imaging architecture with a precision motion system to achieve unrivaled semiconductor wafer inspection throughput and defect detection sensitivity for post-fab applications.
Proprietary image processing algorithms and special lighting techniques produce reliable and consistent inspection results. Dual cassette robotic wafer handling with lot queuing capability and optical character recognition for wafer identification provide fully automated operation.
Semiconductor companies utilize QuickSilver systems as process management tools to improve device quality and reliability. Gold and solder bump defect detection is an essential process control step to guarantee bump integrity. The ability of QuickSilver inspection systems to detect a wide range of bump defects, including over or undersized bumps, bump nodules, and shorted bumps, prevents damage to sensitive device electrical testing equipment and avoids the high cost of packaging defective die.
Customers and company representatives nominate candidates for the award. The editors of Test & Measurement World then selected ten products from the hundreds of nominees. The winners will receive the award at a ceremony in Anaheim, Calif., during the week of Nepcon West.
For more information on QuickSilver, contact Electroglas Inspection Products Division at 541/967-1211.
About Electroglas, Inc.
Electroglas delivers essential tools for process management designed to enhance semiconductor companies' profitability. The company's wafer probers, inspection systems and software solutions serve as data collection, management, and analysis tools that semiconductor manufacturers depend on to improve their productivity and process control by optimizing sort-floor efficiency.
Electroglas has been a leading supplier of wafer probers for over 35 years and has an installed base of more than 10,000 systems. The company's stock trades on the NASDAQ National Market under the symbol ''EGLS.'' The company's World Wide Web site is located at www.electroglas.com.
QuickSilver is a trademark of Electroglas Inc.
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