Plasma and Materials Technologies !!!! Message Board

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Technology Stocks : Plasma and Materials Technologies !!!!

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To: Tim MacLean who wrote (294)	2/12/1997 5:00:00 PM
From: Mike Stills	of 383

OK, I'll take my licks for being negative but in this case the "whole truth" is not embodied in something as simple as a claim to have found a low dielectric constant material. To quote from an Article in Semiconductor International (May 1996) : "In adddition to a low dielectric constant, films must exhibit excellent gap filling, good thermal stability, low moisture absorption, high thermal conductivity and good adhesion. It's also important that they be processed from common, low-toxicity solvents. Also of concern are properties such as strength and stiffness, elasticity and thermal expansion; process-related issues such as etch and CMP characteristics; and more mundane issues such as commercial availability, shelf life, deposition method and, of course, cost" (I'll add wafer damage and yield to the list). None of this is simple or clear-cut. I'd suggest that other respondents to this thread, read the Semiconductor International Article before making $$ decisions based on the PMT claims - and again sorry if I offended anyone.

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