Intel Corporation (INTC) Message Board

STOCKTALK

We've detected that you're using an ad content blocking browser plug-in or feature. Ads provide a critical source of revenue to the continued operation of Silicon Investor. We ask that you disable ad blocking while on Silicon Investor in the best interests of our community. If you are not using an ad blocker but are still receiving this message, make sure your browser's tracking protection is set to the 'standard' level.

Technology Stocks : Intel Corporation (INTC)

INTC 36.07

+4.6%

1:56 PM EST

Public Reply Prvt Reply Mark as Last Read File

Previous 10 Next 10 Previous Next

To: Paul Engel who wrote (76392)	3/16/1999 1:28:00 AM
From: greenspirit	Read Replies (1) of 186894

Paul and all, Setting industry standards is one of the greatest competitive advantages Intel has. They don't seem to be slacking one bit in nailing new patents to protect future interests. _____________________________________________________________________ Article... Heat exchanger system for cooling a hinged computing device (Assignee -- Intel Corporation) March 15, 1999 U.S. Patents : Abstract: A heat exchanger system for use in a hinged computing device is provided. The hinged computing device includes a base housing connected to a display housing by one or more hinges. A number of heat generating electronic components are located within the base housing, and a display screen is positioned in the display housing. The heat exchanger system includes a heat pipe located in the base and thermally coupled to both an electronic component and the hinge to allow heat transfer from the electronic component to the hinge. A flat plate heat pipe located in the display housing is mechanically and thermally coupled to the hinge to allow heat transfer from the hinge to the flat plate heat pipe for dissipation through the display housing. Ex Claim Text: A heat exchanger system for transferring heat generated by an electronic component located in a first part of a computing device to a second part thereof for dissipation into the surrounding environment, said first part of the computing device being coupled to said second part by a thermally conductive hinge having a first hinge section and a second hinge section, said heat exchanger system comprising: a heat pipe located in the first part of the computing device and thermally coupled between the electronic component and the first hinge section; and a flat plate heat pipe located in the second part of the computing device, said flat plate heat pipe being thermally coupled to the second hinge section. Patent Number: 5880929 Issue Date: 1999 03 09

Report TOU Violation

Share This Post

Public Reply Prvt Reply Mark as Last Read File

Previous 10 Next 10 Previous Next