HYSEQ AWARDED PATENT ON DEVICE FOR PRINTING PROBES ON DNA CHIPS IN A SINGLE STEP
--Device May Simplify DNA Chip Production--
SUNNYVALE, CA, March 16, 1999 ŽË¡©yseq, Inc. (Nasdaq: HYSQ) today announced the issuance of United States Patent No. 5,882,930, titled
"Reagent Transfer Device", which covers a printing device to enhance the speed and efficiency for the production of DNA chips.
"This device allows us to deposit all probes onto a chip or other surfaces in a single step, rather than in multiple steps, or in the complex 'in situ' probe
synthesis process presently being used by other chip makers," said Lewis S. Gruber, President and CEO of Hyseq, Inc.
"We believe this device will have significant advantages for DNA chip production," said Joerg W. Baier, Director of Engineering and Technology,
HyChipTM Project Leader and the inventor of the device. "This patent demonstrates our commitment to parallel processing and high throughput
improvements."
Hyseq, Inc., based in Sunnyvale, California, is a biopharmaceutical company with a growing pipeline of biopharmaceutical product candidates in its
proprietary HyProfile™ portfolio. Hyseq offers pharmacogenomics/polymorphism databases and believes that its fast-growing proprietary
HyGenomics™ database of partial human DNA sample sequences is the worldÃÔ largest. In gene chip technology, Hyseq, with its partner, PE
Corporation (formerly known as The Perkin-Elmer Corporation) offers the only universal sequencing chip through their HyChip™ Early Access
Program. Information about Hyseq is available on the World Wide Web at hyseq.com or by phoning (408) 524-8100.
ANY COMMENTS FROM THOSE IN THE KNOW ABOUT CHIP PRODUCTION? |
