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HYSEQ AWARDED PATENT ON DEVICE FOR PRINTING PROBES ON DNA CHIPS IN A SINGLE
STEP --Device May Simplify DNA Chip Production--
SUNNYVALE, CA, March 16, 1999 Hyseq, Inc. (Nasdaq: HYSQ) today announced the issuance of
United States Patent No. 5,882,930, titled
"Reagent Transfer Device", which covers a printing device to enhance the speed and efficiency for
the production of DNA chips.
"This device allows us to deposit all probes onto a chip or other surfaces in a single step, rather
than in multiple steps, or in the complex 'in situ' probE synthesis process presently being used by
other chip makers," said Lewis S. Gruber, President and CEO of Hyseq, Inc.
"We believe this device will have significant advantages for DNA chip production," said Joerg W.
Baier, Director of Engineering and Technology, HyChipTM Project Leader and the inventor of the
device. "This patent demonstrates our commitment to parallel processing and high throughput
improvements."
Hyseq, Inc., based in Sunnyvale, California, is a biopharmaceutical company with a growing
pipeline of biopharmaceutical product candidates in its proprietary HyProfile™ portfolio.
Hyseq offers pharmacogenomics/polymorphism databases and believes that its fast-growing
proprietary HyGenomics™ database of partial human DNA sample sequences is the worldÃÔ
largest. IN gene chip technology, Hyseq, with its partner, PE Corporation (formerly known as The
Perkin-Elmer Corporation) offers the only universal sequencing chip through their HyChip™
Early Access Program. Information about Hyseq is available on the World Wide Web at
hyseq.com
or by phoning (408) 524-8100.
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ANY COMMENTS FROM THOSE IN THE KNOW ABOUT CHIP PRODUCTION?
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