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Technology Stocks : Micron Only Forum
MU 246.95+4.1%Dec 8 3:59 PM EST
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To: Zeev Hed who wrote (44515)3/28/1999 10:45:00 PM
From: Fabeyes  Read Replies (1) of 53903
 
There are several schools of thought. But there is a PCVD deposition and an actual metal sputtering. It works best with as much of a pure percentage of the desired metal. Alum., copper, gold, etc. So most people would like to have this form, no matter how they get it on the wafer. Gold will be the next to be tried; I have heard rumors of Hitachi working on this, and I know IBM will be too. Sounds expensive but it are not. You have less metal resistance, which means a better and more reliable part not effected by outside sources, heat, cold, gamma, etc.

I have not worked on any damascene process for a year so there are better people to tell you the latest. Try to keep up though.
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