Intel Investors - Intel will introduce a low voltage (1.8 V) 16 Meg Boot-Block Flash EPROM for cell phone applications.
It will include "security" features !
"The 1.8-V parts carry the same functions as Intel's previous Advanced+ Boot Block parts. They can lock particular sectors of code to protect boot code from being overwritten, for example. The parts also carry the 128-bit identification register that Intel has been providing on flash parts since last year. Similar to the Pentium III identification number, the register is one-time programmable and is completed half by Intel and half by the cellular phone maker."
Paul
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Intel preps flash parts for cell phones
By Craig Matsumoto, EE Times Mar 29, 1999 (7:38 AM)
URL: eetimes.com
RIO RANCHO, N.M. — Intel Corp. is readying the latest version of its boot-block flash with a family of parts aimed at the cellular phone market. The new 1.8-V version of Intel's Advanced+ Boot Block flash is a successor to higher-voltage members of Intel's Advanced+ family. The part's introduction is being timed to match the expected arrival of 1.8-V cellular phones at the end of the year.
The 1.8-V parts carry the same functions as Intel's previous Advanced+ Boot Block parts. They can lock particular sectors of code to protect boot code from being overwritten, for example. The parts also carry the 128-bit identification register that Intel has been providing on flash parts since last year. Similar to the Pentium III identification number, the register is one-time programmable and is completed half by Intel and half by the cellular phone maker.
Finally, the Advanced+ Boot Block parts have a high-speed-programming mode used by cellular phone manufacturers to speed up their factory production.
The 1.8-V. chips will be available in microBGA packages with a 0.5-mm ball pitch. Cheaper packaging alternatives aren't yet being considered because the part is being targeted strictly at cellular phones, said Rob Morse, product marketing manager for Intel (Santa Clara, Calif.).
Cellular phone makers consider microBGA a viable package, said marketing director Curt Nichols said. As other markets for the 1.8-V parts emerge, Intel will consider other, less expensive packages for the part, such as Intel's Easy BGA, Morse said.
The 1.8-V Advanced+ Boot Block flash is due to sample in the third quarter, and production volumes will be available in the fourth quarter. |
