From the same article referenced above:
But before that happens, fab operators will need new tools and technology capable of detecting more potential defects that are 0.10-micron and below in size. The top challenge today in wafer inspection, according to the technology roadmap from the Semiconductor Industry Association, is to develop systems capable of detecting defects, particles, and residues inside tiny vias, canals, and contacts in interconnect structures. This is especially true when
corrosive copper is involved. The toughest part of this job
will be to get enough light into the holes and canals to detect a usable image.
Falstaff, correct me if I'm wrong, but this sounds to me like a job that JMAR PSI could do - using Britelight, plus their precision motion control and inspection devices, which, according to the company video, "have 1/1-millionth of an inch precision". I'm just thinking to myself here, but if they combined Britelight with one of their inspection devices, couldn't they come up with something such as this?
Betty |
