Formerly About Advanced Micro Devices Message Board

STOCKTALK

We've detected that you're using an ad content blocking browser plug-in or feature. Ads provide a critical source of revenue to the continued operation of Silicon Investor. We ask that you disable ad blocking while on Silicon Investor in the best interests of our community. If you are not using an ad blocker but are still receiving this message, make sure your browser's tracking protection is set to the 'standard' level.

Politics : Formerly About Advanced Micro Devices

Public Reply Prvt Reply Mark as Last Read File

Previous 10 Next 10 Previous Next

To: Yousef who wrote (54038)	4/2/1999 9:30:00 PM
From: Process Boy	Read Replies (1) of 1570972

Yousef <I think you are being a "Nervous Nellie" on this one ... Physical separation is an obvious and easy thing to do as one approach.> You very well may be correct. <BTW, there is a considerable amount of copper in your Fab right now. the aluminum used as interconnect contains .5% Copper for example. I'm much more worried about process integration issue that will directly impact yield and control of electrical parameters. BTW Process Boy, which part of the process do you work in ??> Regarding Integration and device issues, I agree totally with you. No question the Cu tack is a big risk. I could debate with you on the difference between a 0.5% concentration of Cu in Al, and 100% Cu, but I will cede that I am indicating WC scenarios. If you agree, lets take this gentlemen's debate up again in a couple of years when some more data is in, or whenever it seems pertinent due to some news. For your last question, unfortunately I feel the need to remain anonymous on this thread. If I divulge even cursory information about my position, it would probably compromise my anonimity. Bummer. PB

Report TOU Violation

Share This Post

Public Reply Prvt Reply Mark as Last Read File

Previous 10 Next 10 Previous Next