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Politics : Formerly About Advanced Micro Devices
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To: RDM who wrote (54099)4/3/1999 6:48:00 PM
From: kash johal   of 1573936
 
RDM,

Re: Cu vs Al for INTC and AMD

I believe the answer is a tad bit more complicated.

Intel appears to use a less agressive rule set for it's contacts, via's and metal pitch. It results in a more robust "bullet proof" higher yielding process but also results in larger die sizes. Inherently RC will be less for such a process and so benefits from a reduction in RC will less in percentage terms.

AMD on the other hand employs a very agressive metal pitch and contact/via sizes. It's die are smaller but also closer to the "hairy" edge. It will benefit much more in terms of the RC reduction of cu- even at 0.18 micron.

One could see a 5-10% increase in clock speeds for AMD versus possibly only a 1-3% increase for Intel at 0.18 micron.

So the rationale behind AMD's choice is solid. Unfortunately it is a huge risk as well if they flub the Dresden volume ramp.

Regards,

Kash J.

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