SI
SI
discoversearch

We've detected that you're using an ad content blocking browser plug-in or feature. Ads provide a critical source of revenue to the continued operation of Silicon Investor.  We ask that you disable ad blocking while on Silicon Investor in the best interests of our community.  If you are not using an ad blocker but are still receiving this message, make sure your browser's tracking protection is set to the 'standard' level.
Technology Stocks : PRI Automation (PRIA)

 Public ReplyPrvt ReplyMark as Last ReadFilePrevious 10Next 10PreviousNext  
To: Warpfactor who wrote (649)4/7/1999 12:05:00 PM
From: Nevin S.  Read Replies (1) of 1214
 
I cannot speak to the rumors you mention about a Daifuku win for Intel 300mm line but I did see this on another thread that seems to indicate that the pilot project is on hold at least for the time being. All this aside, I understand one of the Taiwanese foundry's is moving ahead with a 300mm pilot project (I think TSMC).

Message 8604829

Semi-Equip news from Merrill-Lynch:

Intel regularly meets with semiconductor equipment
suppliers and had just such a meeting last week.
ML: There were several important data points that came out
of the meeting. First, there is no clear timetable for the
300mm at Intel. We think Intel's enthusiasm for 300mm
technology at the operating level was squashed at the
business level. Craig Barrett knows the pain of a wafer
transition after managing the 150mm wafer transition at
Intel in the mid-80's. We do not think Intel will move ahead
with 300mm until it is economical and do not expect a
decision until the 4 quarter at the earliest. Second, Intel
now plans to qualify more than one vendor for each tool
abandoning the gold plated “copy exact” strategy adopted 8
yeas ago.. Both these decisions are core to slowing the
growth in depreciation expense- a top priority as the mix of
MPU business moves to the lower end.
Report TOU ViolationShare This Post
 Public ReplyPrvt ReplyMark as Last ReadFilePrevious 10Next 10PreviousNext