Novellus Introduces Next-Generation Copper Electrofill Tool
New tool incorporates lessons learned from thousands of hours of production experience and provides enabling electrofill technology for volume manufacturing at 0.13 micron
SAN JOSE, Calif.--(BUSINESS WIRE)--April 7, 1999-- Novellus Systems Inc. (Nasdaq:NVLS - news), the productivity and innovation leader in thin film deposition technologies for the global semiconductor industry, today introduced its next-generation SABRE-xT(tm) copper electrofill system.
The new system incorporates technology, productivity and reliability enhancements gleaned from the experience Novellus has gained in processing more than 350,000 wafers in fabs around the world with the original SABRE(tm) electrofill system introduced last June. SABRE-xT delivers a complete electrofill solution for volume production of 0.13 micron copper interconnects.
Using a combination of proprietary techniques and advanced chemistries, SABRE-xT delivers the production capability and repeatability needed to produce copper interconnects with aspect ratios as high as 10:1 and geometries as small as 0.13 micron. The new system uses the original SABRE cell design and tool architecture and has the same footprint, while delivering increased throughput of up to 75 wafers per hour (wph). With a wafer size kit change, it is capable of running both 200 and 300 mm wafers.
The transition to copper-based devices is rapidly gaining momentum, with several leading semiconductor manufacturers announcing plans to move into volume production by the end of 1999. The ramp up to volume production using new copper processes will require fabs to successfully address such issues as process reliability and repeatability, successful integration of barrier/seed, dielectric and chemical mechanical planarization (CMP) processes and monitoring/control of the electrofill chemistry.
''We have more than three years' experience in copper deposition, including two years of production experience and a year of process integration experience working with semiconductor manufacturers worldwide,'' said John Chenault, executive vice president of Novellus' Metals Group. ''As these companies shift to volume production of copper-based ICs, only Novellus with our SABRE tool has the expertise and the production-proven electrofill capability needed to ensure a successful ramp to volume manufacturing.''
The next-generation SABRE-xT system incorporates process enhancements in the areas of variable electrical waveforms, advanced bath chemistries and bath chemistry monitoring and control. Novellus also addresses the requirements for chemical delivery and environmental management of the electrofill chemicals. These enhancements address the critical issues needed to enable advanced feature electrofill down to 0.13 micron geometries.
The SABRE-xT system offers multiple electrical waveforms or current options for use in the electrofill process. These include constant direct current(DC), variable step DC and reverse pulse plating. Such waveforms provide the process flexibility that is required to address the myriad of dual damascene structures and aspect ratios, various etch profiles and inferior barrier/seed layers used in copper integration today. With SABRE-xT, the operator is able to select the electrical waveform that is optimal for the application.
The choice of advanced chemistries used in the electrofill bath plays a key role in ensuring void-free, seamless fill in copper interconnect structures. Novellus has partnered with Shipley Ronal, a leading manufacturer of chemicals for electrofill applications, to develop and test new chemistries for sub-0.25 micron geometries. The new chemistries developed as a result of this partnership are available directly from Shipley Ronal for all SABRE systems.
Control of the bath chemistry and management of the electrofill chemicals are key to successful volume manufacturing of copper-based ICs. Failure to effectively control the variables in the bath chemistry will significantly degrade process repeatability and reliability. To help control these variables Novellus has developed a patented, predictive dosing approach, known as SmartDose(tm), for the SABRE product line, which provides predictive dosing of bath chemicals based on production volume and the plating process in use. To provide additional convenience to the user, the SABRE-xT system also offers an automatic bath monitoring option that eliminates human intervention. SABRE-xT bath control features have resulted in consistently demonstrated wafer-to-wafer reproducibility of less than 3% (3 sigma).
Novellus also offers bulk chemical delivery for accurate electrofill chemical dispensing and has been working with suppliers to deliver solutions for treatment of the electrofill waste constituents.
Novellus' SABRE-xT systems are available now with normal lead time deliveries.
About Novellus Systems
Novellus Systems Inc. manufactures, markets and services advanced automated wafer fabrication systems for the deposition of thin films. Novellus deposition systems are designed for high-volume production of advanced, leading-edge semiconductors at the lowest overall cost. Headquartered in San Jose, Calif., with subsidiaries in the United Kingdom, France, Germany, the Netherlands, China, Japan, Korea, Singapore and Taiwan, Novellus is a publicly traded company on the Nasdaq stock exchange (Nasdaq:NVLS - news).
Additional information about the company is available on Novellus' home page on the World Wide Web, located at novellus.com.
Note to Editors: SABRE-xT, SABRE and SmartDose are all trademarks of Novellus Systems.
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