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Politics : Formerly About Advanced Micro Devices

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To: Process Boy who wrote (55292)4/13/1999 12:52:00 PM
From: Yougang Xiao  Read Replies (2) of 1573191
 
PB, Mani, <<AMD .18 by Q3.>>

Taken directly from the latest Letter from JS to holders:

Regarding Fab 25:

"We have successfully developed 180-nanometer, six-layer, aluminum interconnect technology to remain at the leading edge
and have produced advanced processors using this technology both in our development facility in Sunnyvale, California, and in Fab 25 in Austin, Texas. We are on schedule to introduce 180-nanometer technology into high-volume production in the third quarter of
1999.
"

Regarding Fab 30:

"We have commenced process integration wafer starts that will utilize copper interconnect technology resulting from this alliance, and we plan to qualify the process for production by the end of this year in order to generate revenues from Fab 30 in the first
quarter of 2000."


"We have completed construction of Fab 30, and are in the process of installing equipment and qualifying the facility to commence commercial production by the end of this year.
When fully equipped, Fab 30 will also be capable of producing 250,000 wafers per year employing technologies of 180 nanometers and finer with copper interconnects."

amd.com
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