LSI Logic Licenses EPBGA Package Technology to Global Packaging Leader Amkor Technology
MILPITAS, Calif. and WEST CHESTER, Pa., April 28 /PRNewswire/
-- System-on-a-chip leader LSI Logic Corporation (NYSE: LSI) and worldwide packaging leader Amkor Technology Inc. (Nasdaq: AMKR) today announced a licensing agreement that provides Amkor access to LSI Logic's Enhanced Plastic Ball Grid Array (EPBGA) technology, a key component in high volume system-on-a-chip integration.
As a result of the agreement, Amkor customers who require cost-effective high-performance package solutions will now be able to leverage LSI Logic's leading edge package technology. LSI Logic previously had licensed its organic laminate flip chip technology to Amkor in December 1998.
"We are pleased to have the opportunity to license another key component of LSI Logic's advanced packaging process technology that makes single-chip systems a reality," said John Boruch, president of Amkor. "This package family is well suited to the performance needs of high-end computers and high-speed communications applications."
"The endorsement from Amkor, the world's largest contract semiconductor packaging and test services, is yet another building block in the foundation establishing LSI Logic's packaging technology as the industry standard," said Maniam Alagaratnam, LSI Logic vice president of package development. "LSI Logic has consistently provided advanced packaging technology capable of meeting the high performance requirements of system-on-a-chip designs. Amkor utilizes its packaging expertise to ensure that this technology achieves the high volume and reliable production levels expected by customers."
The EPBGA package utilizes a four-layer BT laminate substrate that incorporates full power and ground planes. The routing is optimized for excellent electrical performance. The package can be customized to have split power planes to accommodate multiple I/O voltages. The design of the EPBGA provides low capacitance and inductance characteristics. This is ideal for high-speed applications.
About LSI Logic
LSI Logic Corporation, The System on a Chip Company(R), is a leading supplier of custom high-performance semiconductors with operations worldwide. The company enables customers to build complete systems on a single chip with its CoreWarea design program, thereby increasing performance, lowering system costs and accelerating time to market. LSI Logic develops application-optimized products in partnership with trendsetting customers and operates leading-edge, high-volume manufacturing facilities to promote submicron chips. The company maintains a high level of quality, as demonstrated by its ISO 9000 certifications. LSI Logic is headquartered at 1551 McCarthy Blvd., Milpitas, California 95035, 408-433-8000, www.lsilogic.com.
About Amkor
Amkor Technology, Inc. is the world's largest independent provider of semiconductor packaging and test services. The company offers a complete set of services including deep submicron wafer fabrication, wafer probe testing, IC packaging assembly and design, final testing, burn-in, characterization and reliability testing. More information on Amkor Technology, Inc. is available from the company's SEC filings and on Amkor's Web site, amkor.com. Amkor Technology, Inc. is traded on Nasdaq under the symbol AMKR.
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