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Politics : Formerly About Advanced Micro Devices

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To: Kevin K. Spurway who wrote (57622)5/7/1999 6:26:00 PM
From: Paul Engel  Read Replies (2) of 1572225
 
Kevin - Re: "Fab 30 is using some type of pod technology for this"

Are you referring to SMIF containment ?

If so, AMD will be using SMIF containment in FAB 30. This is a Standard Modular Interface Format - for wafer containment and load/unload into process equipment.

It is NOT specific for Copper processing - it merely keeps wafers in an environmentally sealed box during storage and transfer and the SMIF box interfaces to the various tool sets so that the wafers are not exposed to "atmospheric conditions" during transfer in and out of process equipment.

True to form, Fab 25 is NOT a SMIF fab - so ALL THE equipment I/O and wafer handling will be different between the two fabs.

COPY DIFFERENTLY - AMD's motto.

We all know what we can expect.

Paul
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