LSI Logic Now Offers 66-MHz FlexCore PCI Architecture In G11 (.25-Micron) Process
MILPITAS, Calif., May 10 /PRNewswire/ -- LSI Logic (NYSE: LSI), The System on a Chip
Company(R), announced today that it is now offering its 66-MHz FlexCore(R) peripheral
components interconnect (PCI) architecture in G11(TM) (0.25-micron) process technology. The
PCI-66 core, initially introduced in March 1997 in the G10(R) (0.35-micron) process
technology, is the industry's first 66-MHz modular hard macro implementation of the PCI
interface. This core is capable of supporting bus speeds of up to 66-MHz with bus widths of
either 64- or 32-bits. This core enables designers to develop high performance systems on a chip
providing up to 528-Mbytes/second of peak bandwidth.
The PCI-66 core is part of LSI Logic's extensive CoreWare(R) library for system-on-a-chip
designs. It is developed for integration into an ASIC and provides complete interface solutions
for the PCI bus, enabling the development of highly integrated PCI adapter cards and host-bridge
ASICs. The PCI-66 core can be used with LSI Logic's other leading-edge I/O products such as
the Rambus D-RAC core, the GigaBlaze(R) core, and the HyperPHY(TM) core for a
high-performance, system on a chip solution.
"We decided to use the PCI-66 FlexCore architecture because it accelerates our time to market, it
is easily integrated, completely verified, and fully supported," said Ottawa, Ontario-based Bill
Swift, director of engineering for Cisco's Optical Internetworking Business Unit. "LSI Logic is
a recognized leader in high-speed I/O with a strong track record in core integration. They were
the obvious choice for providing the PCI core."
As a hard macro, with a fixed layout, the PCI-66 core has precise clocking and pre-verified
timing for operation up to 66 MHz in 32- or 64-bit modes. This solution lets the ASIC designer
focus on value-added logic and ASIC integration rather than solving the timing challenges of the
PCI interface. Soft macro PCI cores, on the other hand, can require a significant effort to reach
timing closure. In addition, the PCI-66 FlexCore architecture has been extensively tested with
over 40 million cumulative simulation cycles. The architecture has also been proven in both test
chip silicon and used in production ASICs.
The modular FlexCore architecture provides the flexibility required for easy use by offering three
interface options: (1) slave interface for PCI target applications, (2) master/slave interface
supporting PCI host applications, and (3) master/slave/FIFO interface for full functionality with
an asynchronous FIFO interface. These three interface options result in a flexible solution that
lets the ASIC designer select the optimal configuration based on performance and cost
requirements.
"Bandwidth demands on the PCI bus have increased from a number of areas, including
performance-intensive embedded applications such as multi-function peripherals, storage
subsystems and communications subsystems. Coupled with the need for higher densities, higher
performance, and lower power, the PCI-66 in the G11 process is an ideal solution for many of
today's high-speed I/O applications," said Rich Hovey, product line manager, Computer
Products Division, LSI Logic.
The LSI Logic CoreWare methodology program provides a full range of complex building
blocks, proven design methodology, leading edge technology and applications support necessary
to build a complete system on a chip uniquely optimized for the target application. The CoreWare
library includes a full range of RISC(R) microprocessors, Rambusa D-RAC, Fibre Channel,
GigaBlaze, ATM, USB, Ethernet-10, and PHY-110 cores. About LSI Logic
LSI Logic, The System on a Chip Company(R), is a leading supplier of custom
high-performance semiconductors, with operations worldwide. The company enables customers
to build complete systems on a single chip with its CoreWarea design program, which increases
performance, lowers system costs and accelerates time to market. LSI Logic develops
application-optimized products in partnership with trendsetting customers, and operates
leading-edge manufacturing facilities to produce submicron geometry chips. The company
maintains a high level of quality as demonstrated by its ISO 9000 certifications. LSI Logic
Corporation is headquartered at 1551 McCarthy Boulevard, Milpitas, California 95035,
lsilogic.com.
NOTE: The LSI Logic logo design, GigaBlaze, FlexCore, G10, The System on a Chip
Company and CoreWare are registered trademarks and G11, and HyperPHY are trademarks of
LSI Logic Corporation. All other brand or product names may be trademarks or registered
trademarks of their respective companies.
/CONTACT: Karen Suty of LSI Logic, 408-433-6855, or suty@lsil.com; or Sandy Fewkes of
Brodeur Porter Novelli, 408-324-4848, or sfewkes@brodeur.com, for LSI Logic/
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