Toshiba to Launch World's Smallest 128- and 144-Megabit
Rambus DRAM in 600MHz, 711MHz and 800MHz Speeds;
Toshiba Achieves Industry's Smallest Chip Size Using 0.20
Micron Process
IRVINE, Calif.--(BUSINESS WIRE)--May 10, 1999--Toshiba America Electronic
Components Inc. (TAEC) Monday announced 128- and 144-megabit (Mb) Rambus(R)
dynamic random access memory (RDRAM(R)), bringing the two largest
commercially-available Rambus memory capacities to the smallest chips yet realized at
this density.
Samples of these new memory devices have been shipped to Rambus Inc. for testing and
will soon be shipped to customers in module form.
These advanced memory ICs are intended for use in high-performance computers using the
Rambus main memory system, which provides peak data transfer rates of 1.6
gigabytes/second, or two to three times as fast as today's widely used 100 megahertz
(MHz) Synchronous DRAM. Toshiba forecasts that by the year 2001, the RDRAM segment
will grow to approximately a 50 percent share of the main memory market.
"As a result of our advanced 0.20 micron (um) process, Toshiba's 128/144Mb RDRAM die
is the smallest on the market today, enabling us to achieve excellent production
efficiencies," said Jamie Stitt, business development manager, Memory Business Unit at
TAEC. "This high-performance process enables improved yields at the higher speeds and
reduces power consumption."
With its new devices, Toshiba combines Rambus performance advantages with its
leading-edge 0.2um lithography to create the industry's smallest 128Mb and 144Mb devices
at only 103mm(2) and 114mm(2), respectively.
"Toshiba's achievement of small die sizes for its leading-edge 128Mb and 144Mb RDRAMs,
coupled with its success in developing lower-cost CSP packaging offers significant
reassurance to PC OEMs as they prepare for high volume PC shipments," said Subodh
Toprani, vice president and general manager, Industry Enabling Division of Rambus Inc.
Toshiba was the first supplier with confirmed 800MHz, or 1.6 gigabyte per second (GB/s)
functionality, at the 72Mb RDRAM generation, and is one of the first suppliers with these
higher density versions, which provide twice the memory capacity. Both the 128Mb device,
with a x16 configuration, and the 144Mb device, with x18 configuration, are available in
600MHz, 700MHz and 800MHz speeds to support PC600, PC700 and PC800 applications,
respectively. The 144Mb, x18 memory ICs provide 128Mb of usable memory, plus extra bits
to support error correction code (ECC).
"Toshiba is the first supplier to bring RDRAM to market using the 0.20um process, thus
providing an excellent example of the benefits of our Scalable by Design(TM) program," said
Stephen Marlow, vice president, Memory Business Unit for TAEC. "All of our
high-performance 128Mb generation DRAM solutions use the same memory cell design
and 0.20um process, which enables us to ramp capacity quickly to meet market demand.
In addition, this enables us to manufacture these advanced memory solutions at any of
Toshiba's global network of fab facilities."
The 128/144Mb RDRAM components are packaged in a Toshiba-developed 62-pin chip
scale package (CSP) that uses the same production equipment as traditional TSOP
packages. As a result, packaging costs are reduced and throughput is increased compared
to RDRAM packaged in uBGA packaging. This CSP packaging also supports a "mirror
package" that allows simpler design for modules with components on both sides.
Pricing and Availability
Samples of Toshiba's 128Mb and 144Mb RDRAM components are available now, priced at
$85 and $100 each, respectively. See table below for part numbers and available
configurations. Production quantities of these components and related RIMM(TM) and
SO-RIMM(TM) modules will be available in third quarter 1999, and production pricing will be
available at that time.
Toshiba 128Mb/144Mb RDRAM Components
Part Number Data Rate Configuration
TC59RM716MB/RB-6 600MHz x16
TC59RM716MB/RB-7 711MHz x16
TC59RM716MB/RB-8 800MHz x16
TC59RM718MB/RB-6 600MHz x18
TC59RM718MB/RB-7 711MHz x18
TC59RM718MB/RB-8 800MHz x18
About Scalable by Design
Scalable by Design represents Toshiba's commitment to future technologies and is
supported by its modular design approach that enables easier and less expensive transition
to the next process generation or memory density. To make the most efficient use of the
company's wafer fabrication facilities, Toshiba's memory products have been designed for
scalability.
By harnessing advances from the trench cell-based 256Mb DRAM development project and
applying them to the 64Mb and 128Mb densities, Toshiba can seamlessly scale five
generations from 0.35um to 0.15um with one clean room. The result is smooth and
predictable transitions, simplified qualifications and rapid cycling of process and products.
With necessary investments and major technological hurdles overcome at the 0.35um
geometry, only an additional modest 10 percent investment is required for each successive
microlithography refinement. Toshiba is carrying these same principles forward in its 256Mb
DRAM production plans and across other products.
About Toshiba
Toshiba America Electronic Components (TAEC) is the North American engineering,
manufacturing, marketing and sales arm of Toshiba Semiconductor Company and Display
Devices and Components Company. TAEC is recognized as one of the world's largest
suppliers of semiconductor, electronic component and storage solutions. Toshiba's
Semiconductor Company is one of the world's leading manufacturers and suppliers of
semiconductor products including LSIs, microprocessors and controllers, and advanced
memory products, in addition to discrete and bipolar components. The company is also
responsible for global sales and marketing of other major electronic components including
liquid crystal displays, color display and picture tubes, lithium-ion and other secondary
batteries. For additional information, visit TAEC's Web site at, toshiba.com.
Rambus Inc. (Nasdaq:RMBS), based in Mountain View, Calif., develops and licenses
high-speed chip-to-chip interface technology that enables semiconductor memory devices
to keep pace with faster generations of processors and controllers. Providers of
Rambus-based integrated circuits include the world's leading DRAM, ASIC and PC
controller manufacturers. Currently, eight of the world's top-10 semiconductor companies
license Rambus technology. More information on the company and its high-bandwidth
interface technology is available at www.rambus.com. Rambus Inc., 2465 Latham Street,
Mountain View, Calif. 94040, telephone 650/944-8000.
Note: Rambus and RDRAM are registered trademarks of Rambus Inc., and RIMM and
SO-RIMM are trademarks of Rambus Inc. Scalable by Design is a trademark of Toshiba
America Electronic Components Inc. DRAM 99 208.
EDITORS NOTE: Reader inquiries publish 800/879-4963, Ext. 208
CONTACT: Toshiba America Electronic Components, Inc.
Lisa Nemec, 949/455-2293 (not for reader inquiries)
lisa.nemec@taec.toshiba.com
For reader inquiries publish 800/879-4963, Ext. 208
or
The Benjamin Group Inc.
Jan Johnson or Suzanne Foxworth
714/245-7500
jan_johnson@benjamingroup.com or
suzanne_foxworth@benjamingroup.com |
