QUALCOMM CDMA Technologies Announces World's First Third-Generation Chip for CDMA Handsets
- MSM5000 Chipset and Software Solution Paves the Way for Next-Generation Applications Development With Initial Data Rates of 153 Kilobits Per Second -
SAN DIEGO, May 24 /PRNewswire/ -- QUALCOMM Incorporated (Nasdaq: QCOM - news), pioneer and world leader of Code Division Multiple Access digital technology, today announced the introduction of the world's first semiconductor and software solution for the third-generation (3G) air interface standard that has been submitted by the U.S. Telecommunications Industry Association (TIA) to the International Telecommunications Union (ITU). The MSM5000(TM) Mobile Station Modem (MSM(TM)) digital baseband solution, QUALCOMM's seventh- generation MSM, is the first of a new family of chipset and system software solutions designed to support the cdma2000(TM) standard.
In a separate announcement, QUALCOMM also introduced the CSM5000(TM) Cell Site Modem (CSM(TM)) for CDMA infrastructure and test equipment products. Both the MSM5000 and the CSM5000 solutions are compliant with spreading rate 1 of cdma2000 Phase One and will begin field trials in early 2000 with commercial production following the trials.
''Our commitment is to lead the industry by supplying our partners with a clear roadmap and vision for the future and then delivering on our promise,'' said Don Schrock, president of QUALCOMM CDMA Technologies. ''With this announcement, we will ensure the commercial availability of 3G chipsets, software and design tools in the near term. The MSM5000 solution gives our partner manufacturers a clear path forward to develop next-generation wireless devices while keeping full forward and backward compatibility within their product lines.''
The next-generation chipset solution is fully backwards compatible with existing IS-95A and IS-95B networks, providing a seamless migration path to 3G. Existing IS-95A and IS-95B handsets are also forward compatible with cdma2000 networks, allowing operators to quickly and cost effectively introduce new 3G services for their IS-95 networks while maintaining existing wide area coverage for all subscribers.
''We will de-mystify 3G and provide products that meet the real requirements, including fast time to market, low product cost, low power and the high data rates of 3G, of our customers and wireless consumers,'' said Johan Lodenius, vice president of marketing for QUALCOMM CDMA Technologies. ''The MSM5000 architecture is a natural extension of our leading expertise in CDMA technology, as is our entire worldwide product plan for 3G going forward, making the transition to 3G easy and predictable, while maximizing our customers' investments in any CDMA product development.''
The new MSM5000 chipset and system software solution exceeds the ITU's 3G requirements for data rates in full wide area mobility of 144 kilobits per second (kbps) by enabling data rates of 153.6 kbps on both the forward and reverse links. Compliant with cdma2000 Phase One, the MSM5000 gives operators up to twice the overall capacity of voice users over IS-95A and IS-95B systems through the use of features such as, fast 800 Hz forward power control and new modulation and coding schemes. Featuring support for Quick Paging Channel and a 24x searcher, the MSM5000 solution provides up to a 50 percent increase in handset standby time. The system software will include support for IS-95A, IS-95B and cdma2000 as well as packet data, a full Internet protocol suite, voice recognition and many other features.
The New Generation MSM Solution
The MSM5000 chipset and system software, QUALCOMM's seventh-generation MSM, builds upon the successful architecture of QUALCOMM's fifth-generation MSM3000(TM). The digital baseband MSM5000 chip enables manufacturers to meet or exceed the specifications of mobile stations for worldwide cdmaOne(TM) and cdma2000 systems, including IS-95A, IS-95B and its variants for PCS in North America, Japan, Korea and South America. Pin-compatible with the MSM3000, the MSM5000 will be available in the same 176-ball Fine Pitched Ball Grid Array (FBGA) package and 196-ball Plastic Ball Grid Array (PBGA) production package.
The MSM5000 interfaces to QUALCOMM's RF devices, the Q5312 Analog Baseband Processor (BBA2), along with the Q5500 IF Receive AGC Amplifier and Q5505 IF Transmit AGC Amplifier, or with the IFR3000(TM) and IFT3000(TM) IF to Baseband Converters. These devices perform all of the signal processing in the subscriber unit, from IF to audio for compliance with the third-generation cdma2000 Phase One and IS-95A and IS-95B standards.
To support cdma2000 Phase Two, a follow-up chip is planned for introduction subsequent to the MSM5000, this device will be fully backwards compatible with cdma2000 Phase One, IS-95A and IS-95B.
MSM5000 Features
Key features of the MSM5000 chip include:
-- Voice V1 (EVRC, IS96A, PureVoice) on all radio configurations;
-- Packet Data P1 using both fundamental and supplemental channels
supporting 153.6kbps on both the forward and reverse links;
-- Quick Paging Channel and a 24x searcher providing up to a 50 percent increase in handset standby time;
-- Support for Fast Forward Power Control for improved voice capacity;
-- Quasi-Orthogonal Functions Supported (QOF) increasing the number of available forward channels;
-- 2.3-2.7v I/O;
-- 176-ball Fine Pitched Ball Grid Array (FBGA) package and 196-ball Plastic Ball Grid Array (PBGA) packages.
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