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Politics : Formerly About Applied Materials

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Nov 21 9:30 AM EST

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To: Will Lyons who wrote (30671)	5/27/1999 3:17:00 PM
From: Duker	of 70976

Fujitsu to use Applied's copper tools for advanced MPUs A service of Semiconductor Business News, CMP Media Inc. Story updated 2:30 p.m. EST/11:30 a.m., PST, 5/27/99 SANTA CLARA, Calif.--Applied Materials Inc. here today said Fujitsu Ltd. has ordered a copper electrochemical plating system for the creation of interconnects on advanced microprocessors. The copper deposition tool will be delivered to Fujitsu by the end of June. Applied's Electra Cu ECP tool will be integrated with an Electra copper barrier and seed system, which has been in use by Fujitsu in Japan for more than a year, according to the Santa Clara equipment supplier. "Copper represents a critical technological transition that must be carefully managed to ensure its successful implementation," said Naomichi Abe, director of Advanced Process Technology for Fujistu's ULSI Device Development Division in Japan. Applied formally introduced its copper electroplating system last month after demonstrating prototypes to chip makers for nearly a year (see April 8 story). The Electra copper plating platform uses multiple twin processing cells and dual wafer handling to reach throughputs of up to 70 wafers per hour, according to Applied. Applied's Electra Cu Barrier & Seed system was introduced in late 1997. Applied said the system has become the industry's leading copper barrier and seed tool with about 75 process chambers being used by chip makers around the world. The system uses ion metal plasma (IMP) physical vapor deposition (PVD) technology to deposit thin films of tantalum or tantalum nitride barriers followed by a copper seed layer.

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