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Technology Stocks : Intel Corporation (INTC)

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Nov 7 9:30 AM EST

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To: mauser96 who wrote (82335)	6/1/1999 5:08:00 PM
From: Paul Engel	Read Replies (3) of 186894

Lucius - Re: "in the long run wouldn't you expect copper to be superior to aluminum as long as the silicon poisoning problem is licked? " The "poisoning" problem is at the heart of the limitations of copper. The already narrow metal lines have to be surrounded by a discussion barrier - to prevent copper from diffusing into the surrounding oxides and eventually to the silicon substrate. These diffusion barrier films therefore REDUCE the cross sectional area of the copper conductor, negating at least part of the conductivity gain. Remember R = (rho*l)/A The "A" for copper is reduced by the diffusion barriers. Intel has INCREASED "A" on several of their Aluminum films on their 0.18 micron process by thickening UP the aluminum film thickness. This has a negative impact on fringing capacitance for adjacent parallel lines, but Intel also implemented an insulator with a reduced dielectric constant - fluorinated oxides. Paul

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