KLA-Tencor Introduces Overlay Metrology System for 0.13-Micron Design Rules
5300 Tool Enables Lithography Engineers to Tighten Overlay Budgets and Increase Yields
SAN JOSE, Calif.--(BUSINESS WIRE)--June 1, 1999--KLA-Tencor Corp. (Nasdaq:KLAC - news)
today introduced the 5300, the semiconductor equipment industry's first overlay metrology system that
provides the precision and accuracy necessary to control deep ultraviolet (DUV) photolithography cells
down to the 0.13-micron design rule level and beyond.
Designed to handle 200 mm and 300 mm wafers, the 5300 enables metrology and lithography engineers
to more effectively manage their overlay error budgets, which have a direct impact on both device
performance and yield.
As semiconductor design rules and linewidths shrink towards 0.13 micron, and integrated circuits (ICs)
increase in complexity and number of layers, overlay control becomes increasingly difficult. This is
primarily due to tighter overlay error budgets, complex stepper imaging, mix-and-match schemes, and the
extended time delays required for data feedback and reduced-contrast overlay targets. These
low-contrast targets result from advanced chemical mechanical planarization (CMP) and shallow trench
isolation (STI) processes.
In addition, the introduction of new technologies such as copper and dual damascene processing impacts
overlay by causing new alignment issues with microlithographic imaging tools. To address these
challenges, users require a robust overlay control solution that maximizes the productivity of
lithography cells, while providing the accuracy, precision and low-contrast target measurement
capability needed to meet the overlay error budget of advanced devices.
''With the price of DUV lithography cells approaching $10-12 million, under-utilization of these cells
becomes a costly issue,'' said Avi Cohen, general manager of KLA-Tencor's Optical Metrology Division.
''The high-throughput 5300 maximizes lithography cell productivity with a fully-integrated data
analysis system that provides immediate automated stepper and scanner monitoring.
''The 5300's unique single recipe technique enables it to measure low-contrast and asymmetric overlay
targets consistently and reliably. These capabilities, combined with integrated KLASS 4.0 stepper setup
software, enable the litho cell to accelerate increased yields and improved device performance.''
The 5300's features include coherence probe metrology, which utilizes 3D information for optimal
focusing and imaging enhancement for robust overlay measurement. This patented focusing technology is
the only one in the industry that guarantees the correct measurement focus. The 5300 also includes a
CMP solutions toolbox, which incorporates KLA-Tencor's exclusive coherence probe metrology overlay
algorithms for field-proven image formation capability.
Additionally, the CMP solutions toolbox contains a new brightfield algorithm for edge enhancement of
low-contrast targets that automatically compensates for large process variations such as overpolish,
underpolish, dishing, erosion or grainy surfaces. Optional 5300 features include fully-integrated KLASS
4.0 stepper setup software for real-time, automated stepper and scanner corrections; and the Recipe
Database Manager (RDM) software for off-line recipe creation, editing and management, which
maximizes system overall equipment efficiency, especially in multi-product fabs such as foundries.
About KLA-Tencor: KLA-Tencor is the world leader in yield management and process control solutions
for semiconductor manufacturing and related industries. Headquartered in San Jose, the company has
sales and service offices around the world. An S&P 500 company, KLA-Tencor is traded on the Nasdaq
National Market under the symbol KLAC. Additional information about the company is available on the
Internet at www.kla-tencor.com
Contact:
KLA-Tencor Corp.
Holly Nielsen, 408/875-6487
holly.nielsen@kla-tencor.com
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