Intel Corporation (INTC) Message Board

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Technology Stocks : Intel Corporation (INTC)

INTC 37.04

-6.2%

Nov 4 3:59 PM EST

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To: Aaron Cooperband who wrote (82543)	6/3/1999 12:59:00 AM
From: Elmer	Read Replies (1) of 186894

Re: "In Intel's annual report there is a picture of a processed wafer. There are many partial chips on it all around the edges." The mask plates that produce the die actually contain more than 1 die on them. There may be 2 or 4 etc. That's why you see partial die around the edges. And rest assured that the die have positioned to produce the greatest number of complete die possible on a round wafer. Furthermore, numerous long term reliability studies have shown that die produced on the outside of a wafer tend to be more prone to early life failures. Some companies purposely scrap die from the outside of the wafer, even if they are complete and test out as fully functional. Too risky. EP

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