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Technology Stocks : Intel Corporation (INTC)

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Nov 7 9:30 AM EST

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To: Paul Engel who wrote (82387)	6/3/1999 1:38:00 AM
From: kapkan4u	Read Replies (2) of 186894

<Paul - re: These diffusion barrier films therefore REDUCE the cross sectional area of the copper conductor, negating at least part of the conductivity gain.> eet.com Paul, If a material could be found that acts as both a diffusion barrier and a low-k dielectric, would the copper interconnect scaling be as good as the aluminum ones? Kap.

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