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Technology Stocks : Intel Corporation (INTC)

INTC 37.04

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Nov 4 3:59 PM EST

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To: Aaron Cooperband who wrote (82543)	6/3/1999 1:18:00 PM
From: Paul Engel	Read Replies (1) of 186894

Aaron - Re: "Why do they bother to print these chips around the edges, since they will obviously end up in the trash bin? " In some cases, the master reticle will contain 2 (or more) images sites adjacent to each other. These are "printed" simultaneously, and at the edge one invariably falls partially "off" the wafer and the other "on" the wafer. A second reason could the x-y stepping of the lithography machine which "steps" along X rows by Y columns - in a rectangular matrix. Re: "Also, it seems that if you shifted certain rows so that they were out of alignment with the rows above and below you could squeeze in a few extra chips. Why don't they do this? " After wafer manufacturing, the individual die are "probed" and the wafer probe machines expect a regular x-y matrix of die locations. Moreover, in ASSEMBLY, the wafers are literally SAWN apart with a diamond-tipped saw blade, and again the stage runs in a regular X-Y matrix, so all the scribe lines - between die locations - have to run in perfect, CONTINUOUS, rectangular array of X-Y "lines". Or else the sawe blade will cut through actual die if the die sites are OFFSET. Paul

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