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To: Tony Viola who wrote (83000)6/7/1999 11:20:00 AM
From: Process Boy  Read Replies (1) | Respond to of 186894
 
Tony - <Didn't Intel put off copper until 0.13 because they thought they'd get more bang for their buck in improving the basic transistor performance and K dielectrics (out of my league here)?>

Intel's approach for .18 is to drive basic transistor performance, without having to inject the risk of implementing Copper at this stage in its (Cu's) development. I would / will be curious to get a good feel as to how process integration issues (that translates to yield) are playing out with these processes at .18.

As for Low-K dielectrics, Intel also another very low risk approach with Fluorinated SiO (SiOF). TSMC took this approach also. Next generation low-k dielectrics are very immature at this stage, and bring on a host of integration issues.

Do you have any WAG on defect densities for IBM's Cu process?

PB



To: Tony Viola who wrote (83000)6/7/1999 12:16:00 PM
From: Paul Engel  Read Replies (3) | Respond to of 186894
 
Tony - Re: "Didn't Intel put off copper until 0.13 because they thought they'd get more bang for their buck in improving the basic transistor performance and K dielectrics (out of my league here)?"

You appear to be IN YOUR LEAGUE.

Intel did EXACTLY what you said for their 0.18 micron process.

Paul