Siemens Turbocharges Next-Generation AIN Platform With Sun Microsystems' UltraSPARC Processor-Based Motherboard; GTE System Integration Turns Design in Nine Weeks
Business Editors/Technology Writers
SUPERCOMM 99
ATLANTA--(BUSINESS WIRE)--June 8, 1999--Sun Microsystems
(Nasdaq:SUNW) today announced that Siemens Information and
Communication Networks Inc. has developed a next-generation advanced
intelligent network (AIN) platform anchored on Sun's 64-bit
carrier-grade boards and Solaris 2.6(TM) operating environment.
The system was integrated in nine weeks by GTE's Commercial
Hardware Systems (CHS) division, enabling Siemens to rapidly get to
market with a powerful, scalable and customized telecommunications
service engine.
The selection of Sun Microsystems' SPARCengine Ultra(TM) AXmp
motherboard allowed Siemens to build a faster, more affordable AIN
product called the Fast Feature Platform(TM) II (FFP II). The system,
ideal for existing and emerging service providers, is the first true
AIN-based prepaid phone card platform. In addition to the prepaid card
service, the FFP II offers a full palette of revenue-generating
AIN-Internet interactive call features such as click-to-talk, premium
call screening, one business number, internet-enhanced routing, teen
card and internet phone control.
"The combination of Sun's carrier-grade boards and Solaris(TM)
operating environment provides the technology for a real competitive
advantage for Siemens and its customers," said Marge Breya, vice
president, marketing, Microelectronics, Sun Microsystems, Inc.
"Because Siemens worked with our integrator partner, GTE, on building
this platform, the product was developed fast and could get to market
more quickly."
The SPARCengine Ultra AXmp motherboard's throughput and
reliability were critical in allowing Siemens to develop a product
that offers service providers a sophisticated remote management and
diagnostics system architecture. Because of the AXmp board's power and
size, Siemens was able to build the FFP II on a significantly smaller
system footprint than other platforms.
Natural Migration Path
"As a worldwide leader in providing AIN equipment and
leading-edge services, Siemens is very particular about specifying the
best possible hardware," said Ray Shedden, manager of the AIN business
unit for Siemens. "The Sun AXmp motherboard's inherent speed,
affordability and reliability enabled us to deliver a carrier-class
product that features greater functionality in a denser package.
Consequently, service providers can offer more leading-edge services
cost-effectively and profitably. We can also future-proof our FFP
platform due to the board's ability to accommodate new, faster CPUs as
they become available."
The SPARCengine Ultra AXmp motherboard enables the FFP II to run
on as many as four 64-bit UltraSPARC(TM) processors per computing
element. This enables the development of systems that range from
entry-level desktops to high-end switching systems that can fill up to
90,000 square feet. The SPARCengine Ultra AXmp and Solaris operating
environment solution enabled the development of this strong list of
call features.
To maximize its in-house production scheduling, Siemens opted to
outsource the integration of Sun's and other vendors' products into
the FFP II system, teaming up with one of Sun's Microelectronics
Referral Partners, GTE's CHS division in Taunton, Mass.
Nine-Week Turnaround
"By integrating the FFP II components, GTE was able to leverage
its experience in building a range of products, from industrial-grade
workstations to Bellcore-compliant telco-grade switches," said Chris
Marzilli, director of GTE's CHS division. "The AXmp boards were a
natural fit for the FFP II spec because the boards have such high
compute performance and scalability. The entire production process --
from the day that GTE received Siemens' RFQ to the day of the first
prototype delivery -- took only nine weeks."
GTE is one of Sun Microsystems' major systems integration
partners, which work closely with the Microelectronics group to reduce
original equipment manufacturers' (OEMs') time-to-market. By
integrating powerful standard products into customized solutions
specifically engineered to meet OEM needs, system integrators enable
the OEMs to focus on the development of high-demand applications.
The SPARCengine Ultra AXmp motherboard and the line of
single-slot SPARCengine compactPCI boards are part of Sun Microsystems
Microelectronics' family of carrier-grade products, ensuring
reliability, high availability and scalability for mission-critical
telecommunications applications.
About Siemens Information and Communication Networks
Based in Boca Raton, Fla., Siemens Information and Communication
Networks Inc. provides integrated voice, data and video communications
networks to carrier and enterprise customers. Last year, the company's
7,000 U.S. employees generated sales of nearly $2 billion. Its parent
firm is Siemens, the pioneering electronics giant with more than
400,000 employees worldwide and global sales of over $66 billion. For
more information, visit the company's web site at www.icn.siemens.com.
About Sun Microsystems, Inc.
Since its inception in 1982, a singular vision, "The Network Is
The Computer(TM)," has propelled Sun Microsystems, Inc. (Nasdaq:SUNW)
to its position as a leading provider of high-quality hardware,
software and services for establishing enterprise-wide intranets and
expanding the power of the Internet. With more than $10.5 billion in
annual revenues, Sun can be found in more than 150 countries and on
the World Wide Web at sun.com.
Sun, Sun Microsystems, the Sun logo, Solaris and The Network Is
The Computer are trademarks or registered trademarks of Sun
Microsystems, Inc. in the United States and in other countries. All
SPARC trademarks are used under license and are trademarks or
registered trademarks of SPARC International, Inc. in the United
States and in other countries. Products bearing SPARC trademarks are
based upon an architecture developed by Sun Microsystems, Inc.
Siemens is a registered trademark of Siemens AG. Fast Feature
Platform is a trademark of Siemens Information and Communication
Networks.
--30--AMP/se*
CONTACT: Sun Microsystems, Inc.
Russ Castronovo, 408/544-0288
russ.castronovo@eng.sun.com
or
KVO Public Relations
Tom Breunig, 206/463-1830
tom_breunig@kvo.com
or
Siemens
Tom Phillips, 561/955-3670
thomas.phillips@icn.siemens.com
or
GTE Commercial Hardware Systems
Rob Doolittle, 703/818-5409/pgr 888/646-4920
rob.doolittle@gsc.gte.com
KEYWORD: CALIFORNIA GEORGIA FLORIDA
INDUSTRY KEYWORD: TRADESHOW COMPUTERS/ELECTRONICS COMED PRODUCT
TELECOMMUNICATIONS
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