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To: burn2learn who wrote (83154)6/9/1999 6:33:00 PM
From: Paul Engel  Read Replies (2) | Respond to of 186894
 
Mike - Re: "I was wondering when do you see the need for Intel to build another Fab? Do you see 300 mm as an expansion of an existing Fab or new facility? "

D1C is, I believe, a new facility and will be the development site for the 0.13 micron 300 mm process.

Intel's modus operandi has been to build a new wafer fab for the Technology Development team and move them into that fab for developing and fine tuning the bext process. D1C is this fab for 300 MM.

Once the process is up and running, that development fab will become a production fab - using the same equipment/tool sets and operating personnel.

As an example, D1B was the development fab for the 0.18 micron process (D1B and D1C are both in Oregon) and it is now being transitioned to production now that the development of this process is essentially complete.

As for additional fabs, Intel suspended construction of Fab 16 in Fort Worth Texas, in October of 1997. I believe they have a "shell" only completed - perhaps even less.

Once the 300 MM process is nearing production status - and demand warrants it - Fab 16 will be taken "out of mothballs" and will be completed, probably with the clean room being redesigned to accept the new 300 mm tools and Copper processing.

My guess is that decision won't be made until early in 2001.

Paul