Silicon Investor (SI) -- The First Internet Community

STOCKTALK

We've detected that you're using an ad content blocking browser plug-in or feature. Ads provide a critical source of revenue to the continued operation of Silicon Investor. We ask that you disable ad blocking while on Silicon Investor in the best interests of our community. If you are not using an ad blocker but are still receiving this message, make sure your browser's tracking protection is set to the 'standard' level.

Politics : Formerly About Applied Materials -- Ignore unavailable to you. Want to Upgrade?

To: Tony Viola who wrote (30937)	6/10/1999 12:28:00 PM
From: Katherine Derbyshire	Respond to of 70976

>>Although using larger wafers is far less challenging than other advances that the semiconductor industry is currently wrestling with, it's still a difficult process to implement. << He's right. Compared to copper, or low-k dielectrics, or DUV lithography (or especially to all of those at once!), 300mm is easy. That doesn't mean that it's trivial, but rather that those other things are very very difficult. The biggest changes for 300mm are in wafer handling, while all those other things require extremely significant changes to the process itself. Katherine