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To: Paul Engel who wrote (83246)6/10/1999 10:38:00 PM
From: puborectalis  Respond to of 186894
 
Have to believe this news will turn the tide for Intel..out of the funk.....Intel commits to new process for
making chips

by Tom Quinlan
Knight Ridder Newspapers

Next time Andy Grove says it looks like rain, don't waste time
getting your raincoat - buy stock in an umbrella company. When
Intel yesterday formally announced its widely known timetable to
begin making chips from larger silicon wafers, stock in equipment
manufacturers skyrocketed.

Intel had said numerous times in the past that it expected to move
by 2002 to the new 300-millimeter wafers, whose size helps cut
the cost of chip production. Still, its announcement was taken as
the first solid commitment to the new technology by a major
semiconductor company. As a result, Applied Material's stock
went up $3 a share. KLA-Tencor went up by $5.25. Novellus
Systems got a $4-a-share bump. Shares of Intel rose $1.44 to
close at $53.13.

The core of Intel's announcement was that it would outfit a
state-of-the art manufacturing plant in its Hillsboro, Ore., campus
with 300mm wafer technology. The upgrade also will include two
other technological innovations: equipment to manufacture chips
with more efficient copper wiring, rather than the standard
aluminum, and equipment to etch smaller chips.

Intel will start buying, installing and testing the 300mm technology
within the next few months, said Mike Splinter, vice president and
general manager of Intel's technology and manufacturing group.

"In the past, there have been concerns about whether the
equipment and tools would be production-worthy by (2002),"
Splinter said. "With this announcement we are saying that we're
confident 300mm will be ready by then."

This vote of confidence has been a long time coming.

Equipment manufacturers and Sematech - the chip-industry
consortium created to foster new manufacturing technologies -
have been touting 300mm technology since 1997.

Compared with the current standard 200mm wafers,
manufacturers could make almost 2 1/2 times as many chips on a
single wafer using the larger size. That alone would be enough to
cut the cost of chip manufacturing by as much as 30 percent,
proponents said.



To: Paul Engel who wrote (83246)6/10/1999 10:50:00 PM
From: Elmer  Read Replies (2) | Respond to of 186894
 
Paul - what are you doing posting at 7:25 PM PST when the dinner is at 7:30?

EP



To: Paul Engel who wrote (83246)6/10/1999 11:31:00 PM
From: grok  Respond to of 186894
 
RE: <the 0.13 micron process development will proceed on 200 MM wafers first - as a "low risk" approach, and will be ported to 300 MM only after completion of the 200 MM Program.>

Excellent. Now if only they had done something like this with Rambus. (Or have they???)