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To: unclewest who wrote (22407)6/12/1999 5:22:00 AM
From: unclewest  Respond to of 93625
 
CRN Business Close-Up -- An Interview with T. Symon Chang - Tyan

Jun. 11, 1999 (Computer Reseller News - CMP via COMTEX) -- Associate
Editor Marcia Savage recently met with T. Symon Chang, president and
chief executive of systems board maker Tyan Computer Corp. Chang, a
former executive at Intel and IBM, discussed the latest component
trends.

CRN: You recently returned from the Computex '99 convention in
Taipei, Taiwan. What was the big news at the show?

T. Symon Chang: PC133 [memory technology] was big, in terms of
defining an alternative to Rambus. My personal view is that Rambus is
going to [gain] momentum [with] Intel and a few OEMs. [But] there isn't
going to be enough Rambus memory at a reasonable cost to go around to
anybody else. The rest of the channel, including smaller OEMs,
integrators [and] distributors, are not going to get any Rambus. If
they do get [any], they can't afford to use it because it will be too
expensive, at least for the near future.

In the fall, you will see both camps, [Rambus and PC133], prominently
competing. It's very clear Rambus is a good technology in terms of
performance. It's just a question of cost and some design constraints
that still are not totally overcome.

CRN: What kind of trends might people expect in motherboards?

Chang: I think the 810, [Intel's integrated chipset], will have a
major following in the OEM channel. I think integrated graphics will
become the trend. On the higher end, the major breakout will be the
133MHz front side bus for CPUs. . . . On the server side and on
high-end workstations, the driving force [will be] 64-bit PCI, so I/O
bandwidth will improve dramatically.

The other major trend is for the CPU to go back to the socket
[design], mostly because the cost is lower for the CPU manufacturer to
go back to socket and away from slot. I think in some sense, that's
good. The slot is a big problem because it takes a lot of height [and]
it takes too much vertical space. Going back to socket will take up
floor space, but it wouldn't have the height problem.

CRN: Does it create problems for you in terms of having to
accommodate new interfaces?

Chang: It creates a lot of confusion. For the next year or so, we're
going to have a mixture of slot and socket. The other interesting trend
is we started to offer motherboards that have socket and slot [designs]
on the same board, so customers can use either.

CRN: How do you work with the channel? Do you have any plans to work
with online resellers?

Chang: With the "Internet era," there are fundamental changes in the
channel. I think part of the problem in the Internet era in component
sales is that the sophisticated customer knows what the lowest price is
just by surfing the Web. As a result, it does create a lot of pressure
on regional distributors and smaller distributors, who don't have the
infrastructure to combat this lower margin pressure. We will have an
online store, but with a pricing structure that would protect our
channel.

One of the things people talk about is [how] you can't afford to have
inventory, especially on older models. So I think [with] this online
store, you can think of it as our factory outlet. My take is any
computer part-especially something like a motherboard-that is more than
six months old, is probably worthless because the life cycle is so
short. [With] things that are more than six months old, you're going to
lose money. If our distributors cannot help us to clean that [problem]
up, I think an online store [is good] for us in the near future.

CRN: With margins becoming so thin in the motherboard business, and
the PC hardware business in general, how do you survive? Do you see any
changes you'll have to make?

Chang: We have a strategic alliance with [MiTAC International Inc.],
one of the major OEM suppliers. I think the low-end business is
definitely consolidating. That's pushing everybody to look at their
infrastructure and be more effective. . . . We also have a pilot line
in [MiTAC's] Fremont facility to do development and time-to-market and
small-volume manufacturing.






To: unclewest who wrote (22407)6/12/1999 5:25:00 AM
From: unclewest  Respond to of 93625
 
Intel's orchestration -- Camino to debut in two variations, but company delays faster version

Jun. 11, 1999 (Electronic Buyers News - CMP via COMTEX) -- Intel Corp.
will launch its Camino chipset in two stages, thus delaying its support
for high-speed Direct Rambus DRAM by at least a few weeks, according to
a number of Intel customers.

While a version of the Camino, or 820 chipset as it is officially
known, will indeed ship as scheduled during the third quarter, industry
sources said the device will support only 600-MHz Direct Rambus DRAM,
the slowest speed defined in the Rambus memory specification.

A second, full-fledged Camino chipset supporting 600-, 700-, and
800-MHz Direct RDRAM will ship at least a few weeks later, and possibly
not until November, according to Intel customers.

While it acknowledged the existence of two Camino "skews," Intel said
the chipset schedule is still on track. An Intel spokesman reiterated
"that the 820 ships in Q3. We're definitely going to hit Q3." He would
not say specifically when either skew will ship.

At any other time, a staggered rollout or slight delay would be a
minor concern. But with the introduction coming almost on top of the
holiday selling season, analysts worry that even a small lag may hurt
OEMs' ability to ship Direct Rambus-enabled PCs that support the
specification's fastest memory clock speeds. One DRAM vendor said a
two-stage launch could prove "disastrous."

Industry analysts said motherboard vendors should be able to turn
boards around almost immediately upon receipt of the chipset.

"But as far as shipping those boards to PC vendors and the logistics
of getting those PCs on retail shelves by Christmas-boy, that could be
tight," said Kelly Spang, an analyst with Technology Business Research
Inc., Hampton, N.H.

The purported delay would be the latest pothole in the Camino's road
to market. In March, Intel executives delayed the chipset family (both
the 600-MHz Camino as well as the full-speed version) from June until
September. Following that snag, Intel executives have consistently said
that both Camino versions would ship at the same time in September.

Unlike the first delay, however, the latest push-out appears to have
more to do with marketing concerns than with technical issues,
according to Intel customers, which asked not to be named.

Indeed, analysts said that to their knowledge, Intel has worked any
remaining technical flaws out of the chipset. Mark Edelstone, an
analyst with Morgan Stanley Dean Witter & Co., San Francisco, said the
so-called B1 revision of the Camino chipset taped out last week, and
that designing 800-MHz Direct Rambus-based Camino motherboards "will
not be an issue" for OEMs.

However, several Intel customers said they have been advised not to
expect high-speed Rambus support with the first version of the Camino.
Instead, 800-MHz Rambus initially will be reserved for high-performance
workstations that will use the Intel 840 chipset, a high-end device
that supports up to 8 Gbytes of memory and which also is expected to
launch in September.

Some DRAM vendors said that by withholding support for 800-MHz Direct
RDRAM in the 820 chipset, Intel is ensuring PC makers will buy the
slower-running 600-MHz chips, which are "down-binned" devices that fail
to meet the timing specifications of 800-MHz Rambus. Since early RDRAM
yields will be heavily weighted toward the slower-speed devices, Intel
is in effect creating a market for chips that otherwise might be passed
over by PC makers looking for more performance.

While Intel would not comment on its marketing strategy, the
company's confidential roadmap indicates that it hopes to drive 600-MHz
Direct RDRAM into PCs selling for $1,500 by the fourth quarter.

Ordinarily, this aggressive track would prove difficult, according to
observers.

At an investment conference in San Francisco last week, Farhad
Tabrizi, director of strategic marketing for memory products with
Hyundai Electronics America's Semiconductor Division, San Jose, said a
128-Mbyte memory subsystem stocked with Direct RDRAM will cost between
$200 and $250 this year, possibly dropping to less than $150 by the end
of 2000. Typically, PC OEMs allocate less than 10% of their budget to
main memory, Tabrizi said, which would limit Rambus to higher-end PCs
well into 2000.

However, by restricting the market for higher-performance Rambus
chips, Intel could govern demand in the PC sector and drive down prices
faster than DRAM suppliers are anticipating-a move that would aid in
the proliferation of Rambus-enabled PCs and workstations alike.

"Everyone who's building Rambus is building this year with the
assumption that there will be a price premium," said Bob Fusco, manager
of product marketing for the DRAM business unit of Hitachi
Semiconductor (America) Inc., San Jose. "If Rambus rolls out before the
Camino, there could be a buildup of inventory."

---
Another Change In Camino's Score
- Two Intel 820 Camino chipset versions to be shipped
- 600-MHz Direct Rambus support coming in September
- Faster Camino version delayed

- 800-MHz Direct Rambus will target workstations, 600- and 700-MHz
directed at PCs





To: unclewest who wrote (22407)6/12/1999 5:28:00 AM
From: unclewest  Read Replies (2) | Respond to of 93625
 
Date: 06/12 00:15 EST

Intel 'grads' to ramp volume DRDRAM

Jun. 11, 1999 (Electronic Buyers News - CMP via COMTEX) -- Silicon
Valley- Intel Corp. has been busy handing out the sheepskin to industry
DRAM suppliers, which are in the process of passing their memory
devices through the company's Direct Rambus DRAM validation program.

Samsung Semiconductor Inc. is the most recent chip vendor to earn its
diploma, and earlier this month, received Intel's stamp of approval on
a range of Rambus module densities, including 64- and 128-Mbyte RIMMs.

Samsung joins module maker Kingston Technology Inc., Fountain Valley,
Calif., which has also been granted validation for its RIMMs in
densities ranging from 72 to 288 Mbytes. Other memory-chip and -module
suppliers to have received validation from Intel for RIMMs of varying
densities include Hyundai, LG Semicon, NEC, and Smart Modular
Technologies, according to Intel's validation Web site.

With its RIMMs cleared for takeoff, San Jose-based Samsung will begin
moving from the sample stage to volume production of Direct RDRAM,
according to Avo Kanadjian, senior vice president of memory marketing
at Samsung. "The validations reinforce the industry's confidence in the
Rambus program," Kanadjian said. "We've started mass production to
ensure volume deliveries in September to meet our customers' product
launch dates."

Micron Technology Inc., meanwhile, is bucking to become the next DRAM
supplier to receive validation for its Rambus components. The Boise,
Idaho, company has sent 128/144-Mbit Direct RDRAM samples to Intel and
expects to begin mass producing 600-, 712-, and 800-MHz double-clocked
devices in the second half of the year. The chips will be manufactured
on a 0.18-micron process, which the company claims will allow it to
achieve the smallest die size in the industry.

"Right now, we're working as hard to ramp as our customers would like
us to," said Jeff Mailloux, Micron's marketing manager for DRAM. "We're
preparing and putting things in place assuming that [Direct RDRAM and
its supporting Camino chipset] will make the September launch date."

Mailloux would not speculate as to when Micron expects to receive
validation for its RIMMs. According to Dataquest Inc., San Jose, Direct
RDRAM, as tracked on a per-Mbyte basis, will account for just 3% of all
DRAM shipped this year, but will jump to half of all DRAM shipments in
2001.

In a related development, Santa Clara, Calif.-based Intel has
formally designated three speed grades of Direct RDRAM as PC600, PC700,
and PC800, according to confidential industry roadmaps obtained by EBN.
The designations are meant to represent Direct RDRAM's faster speeds
relative to existing PC100 and PC133 SDRAM, and to differentiate it
from PC266 double-data-rate SDRAM.