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To: unclewest who wrote (22408)6/12/1999 5:35:00 AM
From: unclewest  Respond to of 93625
 
Date: 06/12 00:25 EST

Die size is still a problem but 'we just have to learn to deal with it' -- Panel deems Rambus ready for PC prime time

Jun. 11, 1999 (Electronic Engineering Times - CMP via COMTEX) -- San
Francisco - Despite some jitters along the way, suppliers at a
technology conference here reported that the infrastructure is in place
for Rambus DRAMs to move into the PC market.

Die size remains a concern, suppliers conceded, but all of them
maintained that neither the 10-to-25-percent die-size penalty nor a
higher price tag should hamper the acceptance of RDRAM for
high-performance PCs.

The panel, organized at the Warburg Dillon Read technology conference
last week, included Rambus Inc. chief executive Geoff Tate along with
representatives from DRAM suppliers and test-and-assembly executives.

Die size is the most critical handicap for Rambus parts and is not
likely to see improvement soon, panelists said. For Micron, 128-Mbit
Rambus parts are 20 to 25 percent larger than their synchronous-DRAM
counterparts, said Jeff Mailloux, DRAM marketing manager for Micron
Technology Inc. (Boise, Idaho). Samsung Semiconductors Inc. claimed a
similar number, while Hyundai Electronics quoted 10 to 15 percent.

Those figures reflect the amount of work it takes to adjust to RDRAM
technology, panelists said. Die size is being sacrificed as
manufacturers concentrate on keeping yields high, said Avo Kanadjian,
senior vice president of memory marketing for Samsung.

"Sometimes a slightly [bigger] die size and a slightly improved yield
can be a good deal," he said.

Farhad Tabrizi, director of strategic marketing for Hyundai, said
DRAM makers had gotten "sloppy" with simpler parts such as
extended-data-out memories and would hit technological barriers that
were likely to prevent a blitzkrieg ramp-up of Rambus production.

"We just have to learn to deal with it," Tabrizi said. "At this time
at Hyundai, the die size is 10 percent [larger than SDRAMs], but there
are other, additional factors that disable us."

Rambus' price premium over SDRAM was not seen as a barrier by
panelists, who believe that PC OEMs will pay extra for the added
performance. One example mentioned repeatedly was the Sony Playstation
2, which uses Rambus' memory architecture to drive its ultra-high-end
graphics.

Rambus remains more expensive than SDRAMs, but panelists refused to
classify the two as competitors, saying they aim for different uses. As
DRAMs enter a new age where different types of memory apply to
dif-ferent devices, high-per-formance parts are worth more, panelists
argued, and Rambus' price tag should be irrelevant.

"Rambus is this nice, fast, sexy device. You want performance, you've
got to pay for it. There is no free lunch," Tabrizi said.

Memories account for 5 to 7 percent of a PC's cost these days,
Kanadjian said; panelists believe PC OEMs are willing to see that inch
up to nearly 10 percent for Rambus. "The OEM criteria is to have the
Rambus memory fit within the budget they've allocated," Kanadjian said.

Panelists' belief was that rather than compete with Rambus, the PC133
architecture will be relegated to the bottom of the sub-$1,000 PC zone,
"a natural evolution for the really low end," Tabrizi said.

In the end, whether Rambus can carry a premium depends largely on
demand. "If the supply exceeds the demand, the market will set the
price," Kanadjian said. "It [Rambus] is a commodity part, and it will
be a commodity part."

Potential problems with royalties, packaging and testability all were
dismissed by panelists, who said the royalties aren't causing concern
and the infrastructure will be in place for Rambus DRAMs to hit the PC
market. Tate of Rambus said his goal, admittedly "aggressive," was to
have RDRAM match SDRAM for testability, packaging and PC-board cost by
the end of 2000.

One question that arose was whether Rambus' strategy might strand its
memories at the high end, unable to decrease prices enough to become
attractive for mainstream PCs and unable to attract the mainstream
volumes that would help drive prices down.

Tate said that money from high-end PCs-which he said account for 20
percent of the systems market-should suffice to fund engineering
improvements to drive down costs, which in turn would help Rambus find
eventual acceptance in mainstream PCs. And the high-end demand really
exists, he said: "We've got design wins already that require Rambus."

Other suppliers on the panel were convinced that Rambus would migrate
down the PC price chain, just as other high-end features have done.


-0-





To: unclewest who wrote (22408)6/12/1999 5:36:00 AM
From: unclewest  Respond to of 93625
 
Integrated instrument suite from Tek takes on Rambus, next-gen MPUs

Jun. 11, 1999 (Electronic Engineering Times - CMP via COMTEX) --
Beaverton, Ore. - Tektronix Inc. has unwrapped a suite of integrated
instruments that take on some of the most challenging leading-edge
digital design applications, including Rambus memory systems and
next-generation microprocessors.

Eyeing an integrated solution to enable new computer architecture
designs, the testers are aimed at digital and embedded software
engineers.

The integrated tool set comprises the TLA 714 and 720 portable and
benchtop logic analyzers, the TDS694C digital storage oscilloscope
(DSO) and complementary connection devices. Tek officials said the
instruments work together to provide specialized features and optimized
performance, including time-aligned cross-triggering and extensions of
instrument performance to the device under test (DUT).

The TLA 714/720 logic analyzers replace the original TLA 704/711. To
support next-generation microprocessor designs, the 714 and 720 have
one of the deepest memory configurations in the industry-up to 16
Mbytes.

Also, up to 408 channels can be merged for working with
next-generation microprocessors, and up to 680 channels are available
on a single mainframe for multibus applications. The new analyzers
inherit their predecessors' proprietary MagniVu acquisition technology,
providing each logic-analyzer module with 500-ps timing resolution on
all channels simultaneously.

2-GHz timing

MagniVu also lets he TLA 700s provide 200-MHz synchronous acquisition
and a 400-MHz data rate. The analyzers provide simultaneous 200-MHz
state and 2-GHz/second timing on the same probe.

A few weeks ago, Hewlett-Packard Co. unveiled a logic-analyzer module
carrying a 333-MHz state speed-the fastest available. That unit also
offers 2-GHz timing analysis.

The TLA 700's personality to the outside world is shaped by its
Windows 98 user interface and a PC platform with expanded openness.

Tektronix also has created an Embedded Systems Tools Partners Program
to deliver development and debug solutions for the TLA 700. Its 19
partners will provide software and analysis tools, physical processor
connections and disassembly software.

Tek said that its new DSO, the TDS694C, offers 3-GHz multichannel
single-shot bandwidth on four channels simultaneously. The high analog
bandwidth, simultaneous 10-Gsample/s sample rate on all channels and
high-stability time base allow highly accurate signal-timing
measurements.

The DSO's performance is extended to the DUT with new intelligent
connection devices, including a full-bandwidth active probe and a
1.7-GHz differential probe. The TDS694C can analyze jitter and timing
automatically through an optional embedded Java implementation.

-0-

By: Stan Runyon
Copyright 1999 CMP Media Inc.